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IC封装资料_电感_LQW15AN18NH00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-12811376.63 KB15页239
IC封装资料_电源管理芯片_AMS1117-1_8.pdf
AdvancedMonolithicSystems,Inc.www.advanced-monolithic.comPhone(925)443-0722Fax(925)443-0723AdvancedAMS1117Monolithic1ALOWDROPOUTVO...
2024-12-12811183.2 KB8页168
IC封装资料_电容_0201B102K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128111.05 MB27页95
IC封装资料_电感_NLCV32T-4R7M-EFR.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12810249.79 KB16页226
IC封装资料_电感_NLV32T-4R7J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12810325.01 KB6页123
IC封装资料_电容_0402CG130J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128101.05 MB27页297
IC封装资料_电容_TAJD226K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12810210.32 KB7页11
IC封装资料_电感_YPRH1204-101M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-12810735.47 KB5页147
IC封装资料_连接器_AFC11-S30ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-128101.4 MB10页54
IC封装资料_电容_CL10B332KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B332KB8WPNC●Product:Multi-layerCeramicCapacitorCAP,3.3㎋,50V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-128105.82 MB36页107
IC封装资料_电感_YSPI0750-470M.pdf
SMDPowerInductors-YSPI0750Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12809700.46 KB5页56
IC封装资料_电容_CL10B153KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B153KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12809361.14 KB3页83
IC封装资料_电容_GRM1885C1H102GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12808944.07 KB30页129
IC封装资料_电容_CL03C1R5BA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-128081.4 MB36页61
AB-33W2-12V-E12 (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.A-BRIGHT2/9/20071MULTILAMPSLEDBULBDataSheetFeature:HighefficiencyLEDmaterialsare...
2024-12-11808192.61 KB4页220
IC封装资料_三极管_BSS138BKSH.pdf
1.Productprofile1.1GeneraldescriptionDualN-channelenhancementmodeField-EffectTransistor(FET)inaverysmallSOT363(SC-88)Surface-Mount...
2024-12-128081.46 MB18页184
IC封装资料_电容_EMK212B7225KG-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12808857.12 KB55页44
IC封装资料_电源管理芯片_REF193GSZ-REEL.pdf
PrecisionMicropower,LowDropoutVoltageReferencesDataSheetREF19xSeriesRev.LInformationfurnishedbyAnalogDevicesisbelievedtobeaccurate...
2024-12-12808598.33 KB28页5
IC封装资料_电感_YSPI0724-1R5M.pdf
SMDPowerInductors-YSPI0724Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12807698.31 KB4页168
IC封装资料_连接器_DF12B_5.0_-40DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12807288.67 KB11页79

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