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IC封装资料_三极管_IRFP460PBF.pdf
DocumentNumber:91237www.vishay.comS-81360-Rev.A,28-Jul-081PowerMOSFETIRFP460,SiHFP460VishaySiliconixFEATURES•DynamicdV/dtRating•...
2024-12-12772254.77 KB9页1
IC封装资料_三极管_IPN70R600P7SATMA1.pdf
1IPN70R600P7SRev.2.1,2017-09-15FinalDataSheetPG-SOT223DrainPin2,TabGatePin1SourcePin3MOSFET700VCoolMOSªP7PowerTransistorCoolMOS™...
2024-12-127721.07 MB13页34
IC封装资料_电容_CL10B682KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12772259.58 KB3页63
IC封装资料_连接器_1704978.pdf
https://www.phoenixcontact.com/us/produkte/170497819.10.2012Page1/5PCBterminalblock-ZFKDS1-3,81-1704978Pleasebeinformedthatthedata...
2024-12-12772173.81 KB5页299
IC封装资料_电容_CC0603KRX7R9BB101.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-127711.22 MB13页241
IC封装资料_连接器_1758050.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1277136.13 MB445页132
IC封装资料_电源管理芯片_LT3680IDD_TRPBF.pdf
LT36801RevCFormoreinformationwww.analog.comDocumentFeedback36V,3.5A,2.4MHzStep-DownSwitchingRegulatorwith75µAQuiescentCurrentTheL...
2024-12-12771591.77 KB24页254
IC封装资料_电源管理芯片_RS3236-2_5YF5.pdf
RS3236REVA.31www.run-ic.comLowPower,LowDropout,500mARFLinearRegulatorsFEATURESLowDropoutVoltageThermal-OverloadProtectionOut...
2024-12-12771857.75 KB11页120
IC封装资料_三极管_NTA4001NT1G.pdf
©SemiconductorComponentsIndustries,LLC,2011May,2019−Rev.21PublicationOrderNumber:NTA4001N/DNTA4001N,NVA4001NMOSFET–Single,N-Cha...
2024-12-12770203.58 KB5页63
IC封装资料_电源管理芯片_APX811-31UG-7.pdf
APX811/8124-PinMicroprocessorSupervisorWithManualResetAPX811/812Rev.21of10OCTOBER2009DS31960www.diodes.com©DiodesIncorporated•Pr...
2024-12-12770257.37 KB10页289
IC封装资料_电容_CL10C561JB81PNC.pdf
Supplier:Samsungelectro-mechanicsCL10C561JB81PNCProduct:Multi-layerCeramicCapacitorCAP,560,50V,±5%,C0G,0603AEC-Q200QualifiedA.Dim...
2024-12-127706.16 MB36页264
IC封装资料_电感_NLV32T-R27J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-12770224.35 KB10页103
IC封装资料_电容_0603B563K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127701.26 MB20页205
IC封装资料_三极管_IRLR8726TRPBF.pdf
www.irf.com111/23/09IRLR8726PbFIRLU8726PbFHEXFET��PowerMOSFETNotes��through�areonpage11D-PakIRLR8726PbFI-PakIRLU8726PbFSDGS...
2024-12-12769443.58 KB11页131
IC封装资料_电容_CL10B393KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B393KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12769361.69 KB3页258
IC封装资料_电容_CL31B104KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31F334ZBCNNNC·Product:Multi-layerCeramicCapacitor...
2024-12-127691.45 MB36页228
IC封装资料_三极管_PSMN0R9-25YLC_115.pdf
1.Productprofile1.1GeneraldescriptionLogiclevelenhancementmodeN-channelMOSFETinLFPAKpackage.Thisproductisdesignedandqualifiedforus...
2024-12-127681001.11 KB15页203
IC封装资料_电容_CGA2B3X7S1A474K050BE.pdf
January2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSCGA21005[0402inch]CGA31608...
2024-12-12768723.56 KB18页252
IC封装资料_电感_SWPA4030S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127681.32 MB22页276
IC封装资料_电源管理芯片_LT3799EMSE-1_TRPBF.pdf
LT3799-1137991faFormoreinformationwww.linear.com/LT3799-1nIsolatedPFCLEDDriverwithMinimumNumberofExternalComponentsnVINandVOUTLimi...
2024-12-12768920.29 KB20页212

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