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IC封装资料_电源管理芯片_LTC4089EDJC_TRPBF.pdf
LTC4089/LTC4089-5140895fdFormoreinformationwww.linear.com/LTC4089ApplicAtionsHVINBOOSTHVENINSW4.7µF10µF4.7µF1µFTIMERCLPROGLTC4...
2024-12-12705806 KB26页277
IC封装资料_电容_CC0603KRX7R9BB224.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-127051.22 MB13页61
IC封装资料_电容_GRM188R71H122KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12705944.07 KB30页153
IC封装资料_电容_EMK105B7223KV-F.pdf
SpecSheethttp://www.ty-top.comThedataisreferenceonly.Electricalcharacteristicsvarydependingonenvironmentormeasurementcondition.TAI...
2024-12-12705482.28 KB3页109
IC封装资料_电容_0402B121K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127051.05 MB27页138
IC封装资料_电感_YNR2510-4R7M.pdf
SMDPowerInductors-YNR2510Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12704657.99 KB4页8
IC封装资料_电容_CL10F684ZP8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F684ZP8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12704360.45 KB3页173
IC封装资料_电容_CL10A226MQ8NRNE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12704259.58 KB3页40
IC封装资料_电感_SWPA5040S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127041.32 MB22页282
IC封装资料_连接器_1733677.pdf
https://www.phoenixcontact.com/us/produkte/173367719.10.2012Page1/6PCBterminalblock-SMKDSP1,5/12-5,08-1733677Pleasebeinformedthatt...
2024-12-12704177.5 KB6页8
IC封装资料_电容_GRM1555C1H6R8CA01D.pdf
GRM1555C1H6R8CA01_(0402,C0G:EIA,6.8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12704944.28 KB30页122
IC封装资料_连接器_DF12E_4.0_-20DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12704288.67 KB11页215
IC封装资料_电容_GRM1885C1H182JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12704944.07 KB30页9
IC封装资料_电感_MLF2012A2R2KT000.pdf
February2017INDUCTORSFebruary2017积层铁氧体MLF20122012[0805inch]**表示尺寸代码。JIS[EIA]普通电路用电感器MLF2012型MLF系列更多资料下...
2024-12-12703441.86 KB11页40
IC封装资料_电容_CL10B105KO8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KO8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-127031.45 MB36页237
IC封装资料_电容_CL10A475MQ5LNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12703259.58 KB3页188
IC封装资料_电源管理芯片_LTC4210-2CS6_TRPBF.pdf
LTC4210-1/LTC4210-21421012faFormoreinformationwww.linear.com/LTC4210-1TYPICALAPPLICATIONFEATURESDESCRIPTIONHotSwapControllerin6-Le...
2024-12-12703574.87 KB22页39
IC封装资料_电容_GRM21BR61A106KE19L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comForapplicationsthatdonotrequir...
2024-12-127034.37 MB90页105
IC封装资料_电感_NLCV25T-6R8M-EFRD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12703249.79 KB16页154
IC封装资料_电容_0603N390J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127021.26 MB20页171

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