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IC资料

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IC封装资料_电源管理芯片_LTC3859IUHF_TRPBF.pdf
LTC385913859fbTypicalapplicaTionDescripTionLowIQ,TripleOutput,Buck/Buck/BoostSynchronousControllerTheLTC®3859isahighperformancetr...
2024-12-12608631.38 KB42页78
IC封装资料_电容_CL10B392KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12608259.58 KB3页92
IC封装资料_连接器_1715734.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1260836.13 MB445页299
IC封装资料_连接器_1755574.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMSTBVA2,5/8-GOrderNo.:1755574...
2024-12-12607230.32 KB5页175
IC封装资料_电容_0402B102K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126071.26 MB20页63
IC封装资料_电容_0603F333Z500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126071.26 MB20页133
IC封装资料_电源管理芯片_LT3010EMS8E-5_PBF.pdf
LT3010/LT3010-5130105feFEATURESAPPLICATIONSDESCRIPTION50mA,3Vto80VLowDropoutMicropowerLinearRegulatorTheLT®3010isahighvoltage,mic...
2024-12-12607488.53 KB18页130
IC封装资料_电容_0603B183K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126071.26 MB20页162
IC封装资料_三极管_AO3402.pdf
N-ChannelEnhancementModeMOSFETFeature30V/4.2ARDS(ON)=50mΩ(MAX)@VGS=10V.RDS(ON)=60mΩ(MAX)@VGS=4.5V.SuperHighdensecelldesignforext...
2024-12-126071.1 MB4页256
IC封装资料_电容_EVK105CH1R5BW-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12607653.27 KB26页96
IC封装资料_电容_T491D477K006AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-126061.54 MB23页242
IC封装资料_电容_CL10C0R5CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12606340.11 KB3页61
IC封装资料_电源管理芯片_RT9013-33GB.pdf
RT90131DS9013-10April2011www.richtek.comPinConfigurationsApplications�CDMA/GSMCellularHandsets�PortableInformationAppliances�La...
2024-12-12606384.76 KB13页26
IC封装资料_电源管理芯片_RS3002-5_0YE3.pdf
RS3002REVA.41www.run-ic.com150mA,UltralowPowerConsumption,HighVoltageCMOSLDORegulatorFEATURES•UltralowQuiescentCurrentIQ:2.5µATy...
2024-12-12606660.04 KB15页277
IC封装资料_电感_LQG15HS4N7S02D.pdf
SpecNo.JELF243B-0010Q-01P.1/11MURATAMFG.CO.,LTDCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.ScopeThisreference...
2024-12-12606357.65 KB11页5
IC封装资料_电容_CL21B104KACNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-126061.45 MB36页273
IC封装资料_电容_CL03C0R6CA3GNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-126067.46 MB84页172
IC封装资料_电感_SWPA5040S221MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-126061.32 MB22页46
IC封装资料_电容_CC1206KRX7RABB561.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12606998.46 KB11页198
IC封装资料_电源管理芯片_LT3652EMSE_PBF.pdf
LT365213652feFormoreinformationwww.linear.com/LT3652TYPICALAPPLICATIONDESCRIPTIONPowerTracking2ABatteryChargerforSolarPowerTheLT®...
2024-12-12606600.17 KB26页112

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