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IC资料

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IC封装资料_电容_0603B103K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124981.05 MB27页19
IC封装资料_电容_1206B103K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124981.05 MB27页131
IC封装资料_连接器_DF12_3.0_-80DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12497288.67 KB11页291
IC封装资料_电容_CL10B104MB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12497259.58 KB3页27
IC封装资料_电感_SWPA3012S6R8MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-124971.32 MB22页293
IC封装资料_电源管理芯片_LT3493EDCB_TRPBF.pdf
LT349313493fbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION1.2A,750kHzStep-DownSwitchingRegulatorin2mm×3mmDFNnAutomotiveBatter...
2024-12-12497676.17 KB20页230
IC封装资料_电容_0201B103K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124971.05 MB27页71
IC资料_K50APFF100GRYC4QPMA (BANNER).pdf
DatasheetCompact,single-pointdevicesforerror-proofingofbin-pickingoperations•Rugged,cost-effective,andeasy-to-installsolutionsfor...
2024-12-15497594.46 KB6页172
IC封装资料_电感_NLCV32T-R15M-EFRD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12496249.79 KB16页250
IC封装资料_电感_LQW15ANR10J00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-12496376.63 KB15页92
IC封装资料_电容_CL10C100DB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C100DB81PNC●Product:Multi-layerCeramicCapacitorCAP,10㎊,50V,±0.5㎊,C0G,0603●AEC-Q200Qual...
2024-12-124965.8 MB36页22
IC封装资料_电容_T490B337M006ATE800.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-124961.54 MB23页70
IC封装资料_连接器_DF12D_3.0_-36DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12496288.67 KB11页192
IC封装资料_电容_CL10B102KC8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102KC8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12496368.85 KB3页178
IC封装资料_电容_CL10B122KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B122KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12495361.44 KB3页51
IC封装资料_电源管理芯片_LTC4415IDHC_PBF.pdf
LTC441514415faTypicalapplicaTionFeaTuresDescripTionDual4AIdealDiodeswithAdjustableCurrentLimitTheLTC®4415containstwomonolithicPow...
2024-12-12495435.08 KB20页172
IC封装资料_电容_GCM1885C1H201JA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-124955.94 MB73页281
IC封装资料_三极管_2N7002-7-F.pdf
2N7002Documentnumber:DS11303Rev.33-21of5www.diodes.comJuly2013©DiodesIncorporated2N7002N-CHANNELENHANCEMENTMODEMOSFETProductSumma...
2024-12-12495200.54 KB5页29
IC封装资料_电容_TAJE107M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12494210.32 KB7页270
IC封装资料_电容_GRM1885C1H561JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12494944.07 KB30页55

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