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IC资料

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IC封装资料_电容_CL10C150JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121851259.58 KB3页268
IC封装资料_电源管理芯片_A1212S-1W.pdf
YUANDC-DCCONVERTERShenzhenSunyuanTechnologyCo.,Ltd.A系列AxxxxS-xW1KVDC隔离1W～2W非稳压单输出SIP7脚封装输入电压5,12,15,24VDC输出电...
2024-12-121851365.29 KB3页261
IC封装资料_电容_GCM155R71E103KA37D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1218504.17 MB96页296
IC封装资料_电源管理芯片_LT1965EQ_PBF.pdf
LT1965Series11965fbFormoreinformationwww.linear.com/LT1965FeaturesapplicationsDescription1.1A,LowNoise,LowDropoutLinearRegulatorTh...
2024-12-1218501.04 MB22页64
IC封装资料_电容_GJM1555C1HR80BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12185010.43 MB296页33
IC封装资料_电容_GRM155R61E224KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121850920.26 KB29页237
IC封装资料_电容_GCJ216R72A103KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1218504.17 MB96页291
IC封装资料_三极管_NTR4502PT1G.pdf
©SemiconductorComponentsIndustries,LLC,2003June,2019−Rev.61PublicationOrderNumber:NTR4502P/DNTR4502P,NVTR4502PMOSFET–Power,Sing...
2024-12-121850208.04 KB5页80
IC封装资料_电源管理芯片_SP6641BEK-L-5-0_TR.pdf
1Rev.5/26/05,*PatentPendingSP6641A/6641B500mAAlkalineDC/DCBoostRegulatorinSOT-23©Copyright2002SipexCorporationDESCRIPTIONTheSP664...
2024-12-121850220.98 KB13页88
IC封装资料_电源管理芯片_SP809EK-L-2-9_TR.pdf
SSPP880099//SSPP88110033PPiinnMMiiccrroopprroocceessssoorrSSuuppeerrvviissoorrCCiirrccuuiittNovember2017Rev.2.0.21/8Rev.2.0.2GENER...
2024-12-121849769 KB8页288
IC封装资料_电容_C213A224J9AC000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1218492.2 MB6页145
IC封装资料_机械式继电器_G6K-2F-Y.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-1218491.72 MB9页254
IC封装资料_电源管理芯片_MCP1825S-3302E_DB.pdf
©2008MicrochipTechnologyInc.DS22056B-page1MCP1825/MCP1825SFeatures•500mAOutputCurrentCapability•InputOperatingVoltageRange:2.1V...
2024-12-121849733.69 KB38页63
IC封装资料_连接器_1806258.pdf
https://www.phoenixcontact.com/us/products/180625810/27/2014Page1/7Basestrip-GMSTB2,5/5-GF-7,62-1806258Pleasebeinformedthatthedata...
2024-12-121849283.65 KB7页44
IC封装资料_电容_0603CG9R0C101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218491.05 MB27页164
IC封装资料_电感_NLCV32T-1R0M-EFD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121848249.79 KB16页33
IC封装资料_电源管理芯片_LT3477EFE_TRPBF.pdf
LT347713477fdFormoreinformationwww.linear.com/LT3477TypicalapplicaTionDescripTion3A,DC/DCConverterwithDualRail-to-RailCurrentSense...
2024-12-121848655.73 KB22页300
IC封装资料_电容_CL10F334ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F334ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218481.42 MB36页298
IC封装资料_电容_CL10B104KA8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KA8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218481.45 MB36页4
IC封装资料_电容_0201CGR75C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218481.05 MB27页220

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