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IC资料

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IC封装资料_电容_GRM188R71H562KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12468944.07 KB30页249
IC封装资料_电容_CC0402JRX7R9BB152.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124681.22 MB13页102
IC封装资料_电容_DE1E3KX222MA4BN01F.pdf
LeadTypeDiscCeramicCapacitors(SafetyStandardCertified)ResinMoldingSMDTypeCeramicCapacitors(SafetyStandardCertified)C85E.pdfSep.14,...
2024-12-124681.8 MB73页171
IC封装资料_电容_CC1812KKX7RYBB474.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12468998.46 KB11页46
IC封装资料_电源管理芯片_LTC3633AIFE-2_PBF.pdf
LTC3633A-2/LTC3633A-313633a23fbFormoreinformationwww.linear.com/LTC3633A-2n3.6Vto20VInputVoltageRangen3AOutputCurrentperChannelnUp...
2024-12-12468501.61 KB28页192
IC封装资料_连接器_1754478.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMSTB2,5/4-GOrderNo.:1754478Th...
2024-12-12468229.18 KB5页200
IC封装资料_电容_GRM31CR61A107ME05L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017C02E.pdfNov.27,2017!Note•Pleasereadratingand!CAUTION(forstorage,o...
2024-12-124688.95 MB296页149
IC封装资料_连接器_9631S-34Z02-GFN4.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12467204.61 KB1页15
IC封装资料_电容_TAJA336M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12467210.32 KB7页114
IC封装资料_连接器_SM02B-GHP-A-TBT.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-12467661.08 KB4页108
IC封装资料_电容_T491D106M050AT.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardT2005_T491•8/20/2018FortLauderdale,FL33301USA•954-766-2800•w...
2024-12-124671.47 MB23页274
IC封装资料_电容_CL21A225KAFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A225KAFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-124671.42 MB36页258
IC封装资料_电感_SWPA6045S151MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-124671.32 MB22页137
IC封装资料_电感_NLV32T-181J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12467325.74 KB6页177
IC封装资料_电感_YNR4030-3R3M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12466664.95 KB5页113
IC封装资料_电源管理芯片_LTC4267IDHC-3_TRPBF.pdf
LTC4267-3142673fbFormoreinformationwww.linear.com/LTC4267-3PoweroverEthernetIEEE802.3afPDInterfacewithIntegratedSwitchingRegulator...
2024-12-12466473.89 KB34页161
IC封装资料_电容_TAJB226M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12466210.32 KB7页293
IC封装资料_连接器_AFC01-S32H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-124661.58 MB1页85
IC封装资料_电容_CL10C080DB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12465340.03 KB3页34
IC封装资料_电容_EMK212BJ225MG-TR.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12465653.27 KB26页221

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