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IC资料

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IC封装资料_电容_TAJA686K002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121836210.32 KB7页163
IC封装资料_电容_T491B105K035AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1218361.54 MB23页268
IC封装资料_电容_CL10C150JC8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121836316.28 KB3页274
IC封装资料_连接器_BM28B0.6-16DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121836562.52 KB8页226
IC封装资料_电容_0805B393K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218361.26 MB20页150
IC封装资料_连接器_1804878.pdf
https://www.phoenixcontact.com/us/produkte/180487819.10.2012Page1/7Basestrip-PC4/10-G-7,62-1804878Pleasebeinformedthatthedatashown...
2024-12-121836210.29 KB7页138
IC封装资料_电容_0402CG121J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218351.05 MB27页247
IC封装资料_电源管理芯片_LTC3601EMSE_PBF.pdf
LTC360113601fcFormoreinformationwww.linear.com/LTC3601TYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION1.5A,15VMonolithicSynchrono...
2024-12-121835491.31 KB26页264
IC封装资料_非易失性存储器_MT25QU01GBBB8E12-0SIT.pdf
MicronSerialNORFlashMemory1.8V,MultipleI/O,64KBSectorEraseMT25QU01GBBBFeatures•Stackeddevice(two512Mbdie)•SPI-compatibleserialbu...
2024-12-1218351.18 MB95页148
IC封装资料_电源管理芯片_TLC5926QPWPRQ1.pdf
OUT0OUT15VDDSDOR-EXTGNDSDICLKLEOEVLEDVDD:3.0Vto5.5VSDICLKLEOETLC5926/TLC5927-Q1ControllerToControllerifErrorDetectionUsedProductFo...
2024-12-1218351.81 MB37页169
IC封装资料_电容_CL10C121JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C121JB81PNC●Product:Multi-layerCeramicCapacitorCAP,120㎊,50V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-1218355.8 MB36页185
IC封装资料_连接器_BM28B0.6-30DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121835562.52 KB8页55
IC封装资料_连接器_A0801AWR-06-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-121834334.91 KB1页57
IC封装资料_电容_TAJE227M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121834210.32 KB7页18
IC封装资料_连接器_A2541HWV-30P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121834814.89 KB16页15
IC封装资料_电感_LQG15HS5N1S02D.pdf
SpecNo.:JELF243B_0010T-01P1/13MURATAMFGCO.,LTDCHIPCOILS(CHIPINDUCTORS)LQG15HS□□□□02□REFERENCESPECIFICATION1.ScopeThisreferenc...
2024-12-121834454.09 KB13页118
IC封装资料_电容_0201B221K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218341.05 MB27页32
IC封装资料_电容_CL10B104KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121834259.58 KB3页223
IC封装资料_电源管理芯片_LT1236ACS8-5_PBF.pdf
1LT1236PrecisionReferenceUAOPPLICATITYPICALDUESCRIPTIOTheLT®1236isaprecisionreferencethatcombinesultra-lowdriftandnoisewithexcell...
2024-12-121833308.54 KB12页260
IC封装资料_连接器_M55-6011242R.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121833318.48 KB3页242

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