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IC资料

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IC封装资料_电容_0603X105K100CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217861.26 MB20页185
IC封装资料_电容_GRM1885C1H1R8BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121786944.07 KB30页243
IC封装资料_三极管_TDM3307A.pdf
October25,2017TechcodeSemiconductorLimitedwww.techcodesemi.com1Techcode®P-ChannelEnhancementModeMOSFETTDM3307ADATASHEETDESCRIPTIO...
2024-12-121786777.33 KB7页128
IC封装资料_数据转换器_AD5668BRUZ-1.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1217851.04 MB30页168
IC封装资料_电容_CL10B223KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B223KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121785361.37 KB3页247
IC封装资料_电容_MKP1837310161.pdf
DocumentNumber:26017Fortechnicalquestionscontact;dc-film@vishay.comwww.vishay.comRevision:23-Jun-051MKP1837VishayRoedersteinMetall...
2024-12-121785240 KB3页32
IC封装资料_电容_CC0603JRX7R9BB102.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1217851.22 MB13页257
IC封装资料_电源管理芯片_AP2210K-5.0TRG1.pdf
AP2210Documentnumber:DS37517Rev.2-21of30www.diodes.comJune2016©DiodesIncorporatedAP2210300mARFULDOREGULATORDescriptionTheAP2210is...
2024-12-121785748.86 KB30页69
IC封装资料_电容_0805B123K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217851.26 MB20页134
IC封装资料_电容_CC0402BRNPO9BN8R2.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1217851.22 MB13页70
IC封装资料_电容_0603CG680G500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217851.05 MB27页66
IC封装资料_连接器_KF2EDGCR-X-5.0-10P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121784620.86 KB1页156
IC封装资料_电容_CC0603GRNPO9BN390.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121784998.46 KB11页30
IC封装资料_电容_0201CG2R4C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217841.05 MB27页92
IC封装资料_电容_0201B561K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217831.05 MB27页288
IC封装资料_电容_0603B151K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217831.26 MB20页56
IC封装资料_电感_SDCL1608C18NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121783376.19 KB4页136
IC封装资料_电容_CQ0402CRNPO9BN2R2.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-1217831.81 MB24页148
IC封装资料_信号隔离芯片_FOD2712V.pdf
4/10/03OPTICALLYISOLATEDERRORAMPLIFIERPage1of13FOD2712©2003FairchildSemiconductorCorporationPACKAGEDIMENSIONSFUNCTIONALBLOCKDIAGR...
2024-12-121782670.43 KB14页288
IC封装资料_连接器_DF3A-3P-2DSA.pdf
May.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121782222.32 KB1页266

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