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IC封装资料_电源管理芯片_LTC4054LES5-4.2_TRPBF.pdf
LTC4054L-4.214054l42faTypicalapplicaTionFeaTuresDescripTion150mAStandaloneLinearLi-IonBatteryChargerinThinSOTTheLTC®4054Lisacompl...
2024-12-121723299.22 KB16页156
IC封装资料_电感_SWPA8040S270MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1217221.32 MB22页27
IC封装资料_电容_TAJB335M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121722210.32 KB7页34
IC封装资料_三极管_DMN3404L-7.pdf
DMN3404LDocumentnumber:DS31787Rev.8-21of8www.diodes.comAugust2013©DiodesIncorporatedDMN3404LN-CHANNELENHANCEMENTMODEMOSFETProduct...
2024-12-121722427.91 KB8页225
IC封装资料_电容_CL10B331JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B331JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121721360.63 KB3页205
IC封装资料_电容_TAJC156M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121721210.32 KB7页122
IC封装资料_电感_NLV25T-R56J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-121721215.06 KB9页58
IC封装资料_电感_SDFL1608Q2R2KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121721457.75 KB7页102
IC封装资料_电容_CL05B823KO5NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL05B823KO5NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121721361.47 KB3页25
IC封装资料_电感_NLV32T-151J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121720325.72 KB6页74
IC封装资料_电容_CL10A475KP9NHBC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121720259.58 KB3页257
IC封装资料_电容_GCM155R71H472KA37D.pdf
GCM155R71H472KA37_(0402,X7R:EIA,4700pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121720948.82 KB29页28
IC封装资料_连接器_1715048.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb23,2010ExtractfromtheonlinecatalogMKDS1,5/4OrderNo.:1715048Thef...
2024-12-121720225.8 KB6页87
IC封装资料_连接器_SM07B-GHS-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121720661.06 KB4页105
IC封装资料_电容_TR3D227K010C0050.pdf
TR3www.vishay.comVishaySpragueRevision:07-Feb-20191DocumentNumber:40080Fortechnicalquestions,contact:tantalum@vishay.comTHISDOCUME...
2024-12-121720594.36 KB29页258
IC封装资料_连接器_BM28B0.6-50DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121720562.52 KB8页173
IC封装资料_电容_GRM1555C1H4R0CA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121719920.26 KB29页173
IC封装资料_三极管_IRFR120NTRPBF.pdf
��www.irf.com1��•Lead-Free更多资料下载请到五八文库wk.58sms.com��...
2024-12-121719478.6 KB11页245
IC封装资料_电感_YNR5040-3R3M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121719666.66 KB5页299
IC封装资料_电容_CL10B683KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B683KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121719361.46 KB3页115

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