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IC资料

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IC封装资料_电源管理芯片_SPX5205M5-L-2-5_TR.pdf
150mA,Low-NoiseLDOVoltageRegulatorSPX52051/8REVLFEATURES■■LowNoiseOutputLDO:40μVRMSPossible■■1%InitialAccuracy■■VeryLowQuie...
2024-12-121701469.15 KB8页65
IC封装资料_电源管理芯片_TPS76333DBVRG4.pdf
150−10010020001000t−Time−µsCO=4.7µFESR=0.25ΩTJ=25°C060402080100140120160180200I−OutputCurrent−mAOVO−Changein∆OutputVolt...
2024-12-1217011.18 MB27页67
IC封装资料_电容_CL10B472JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B472JB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121701361.16 KB3页157
IC封装资料_信号隔离芯片_FOD2712_Q.pdf
4/10/03OPTICALLYISOLATEDERRORAMPLIFIERPage1of13FOD2712©2003FairchildSemiconductorCorporationPACKAGEDIMENSIONSFUNCTIONALBLOCKDIAGR...
2024-12-121700670.43 KB14页42
IC封装资料_数据转换器_AD5648BRUZ-1REEL7.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1217001.04 MB30页107
IC封装资料_电容_GRM188R61A335KE15D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121700944.07 KB30页8
IC封装资料_电源管理芯片_TPS76333DBVR.pdf
150−10010020001000t−Time−µsCO=4.7µFESR=0.25ΩTJ=25°C060402080100140120160180200I−OutputCurrent−mAOVO−Changein∆OutputVolt...
2024-12-1217001.21 MB27页118
IC封装资料_电容_CL21A226MAQNNNF.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1217007.55 MB84页113
IC封装资料_电容_CC1206KKX7RZBB102.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1217001.22 MB13页244
IC封装资料_电感_SDFL1608S100KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121700457.75 KB7页266
IC封装资料_电阻_MFR0W4F1002A50.pdf
��UNIROYALELECTRONICSINDUSTRYCO.,LTD.ContentIndex................................................................
2024-12-121700237.37 KB12页289
IC封装资料_电感_NLV25T-R10J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121699316.79 KB6页288
IC封装资料_机械式继电器_G6K-2F.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-1216991.72 MB9页266
IC封装资料_电容_0603B105K160AT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216991.05 MB27页197
IC封装资料_电阻_SDV1005S5R5C030YPTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2015/04/10SunlordIndustrialPark,Dafuyu...
2024-12-121699339.83 KB10页220
IC封装资料_电容_CL10B561KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121699452.9 KB21页58
IC封装资料_电容_TAJA475M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121699210.32 KB7页212
IC封装资料_连接器_AFC11-S53ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1216991.4 MB10页41
IC封装资料_连接器_1766204.pdf
https://www.phoenixcontact.com/us/products/176620410/24/2014Page1/5Basestrip-GMSTB2,5/10-G-7,62-1766204Pleasebeinformedthatthedata...
2024-12-121699169.01 KB5页53
IC封装资料_电容_GRM1555C1H2R0WA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121699920.26 KB29页167

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