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IC封装资料_电容_TAJC155K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121674210.32 KB7页119
IC封装资料_电源管理芯片_XL6004.pdf
Datasheet400KHz60V3ASwitchingCurrentBoostLEDConstantCurrentDriverXL60041FeaturesnWide3.6Vto32VInputVoltageRangen0.22VFBadjustableL...
2024-12-121674351.09 KB10页192
IC封装资料_电感_MLF1608DR10JTD25.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-121674311.11 KB11页163
IC封装资料_电容_0402B102J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1216741.26 MB20页56
IC封装资料_连接器_1733583.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogSMKDSP1,5/3-5,08OrderNo.:1733...
2024-12-121674230.04 KB6页25
IC封装资料_电源管理芯片_MAX706RCSA.pdf
GeneralDescriptionTheMAX706P/R/S/T,MAX706AP/AR/AS/AT,andMAX708R/S/Tmicroprocessor(µP)supervisorycircuitsreducethecomplexityandnum...
2024-12-121674873.18 KB15页147
IC封装资料_连接器_1804849.pdf
https://www.phoenixcontact.com/us/produkte/180484919.10.2012Page1/7Basestrip-PC4/7-G-7,62-1804849Pleasebeinformedthatthedatashowni...
2024-12-121674210.39 KB7页269
IC封装资料_电感_WPN4020H2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121673624.92 KB9页171
IC封装资料_电容_CL10B102KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121673452.9 KB21页9
IC封装资料_电感_MLF2012DR68KT000.pdf
February2017INDUCTORSFebruary2017积层铁氧体MLF20122012[0805inch]**表示尺寸代码。JIS[EIA]普通电路用电感器MLF2012型MLF系列更多资料下...
2024-12-121673441.86 KB11页159
IC封装资料_电源管理芯片_TPS61169DCKR.pdf
SWVINCTRLFBLCINCOUTPWMDIMMINGCONTROLRSETVBATGNDTPS61169DProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAn...
2024-12-1216721.12 MB24页161
IC封装资料_电容_GRM1885C1H6R8DA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121672944.07 KB30页234
IC封装资料_电源管理芯片_LT1964ES5-BYP_TRMPBF.pdf
LT196411964fbTYPICALAPPLICATIONDESCRIPTION200mA,LowNoise,LowDropoutNegativeMicropowerRegulatorTheLT®1964isamicropowerlownoise,low...
2024-12-121671310.3 KB16页197
IC封装资料_电容_CC1206KKX5R9BB106.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1216711.22 MB13页137
IC封装资料_电容_GCJ31BR72J472KXJ1L.pdf
IC封装资料_电容_GCJ31BR72J472KXJ1L.pdf
2024-12-121671956.85 KB1页141
IC封装资料_电容_CL05A225KQ5NSNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL05A225KQ5NSNC·Product:Multi-layerCeramicCapacitor...
2024-12-121671397.26 KB3页52
IC封装资料_电容_CC0805KKX7RABB223.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121671998.46 KB11页119
IC封装资料_电容_1206B223K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216711.05 MB27页233
IC封装资料_连接器_A2541HWV-39P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121671814.83 KB16页127
IC封装资料_连接器_1803455.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12167036.13 MB445页253

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