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IC封装资料_电容_CL21B105KOFNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KOFNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-12158456.17 KB3页118
IC封装资料_电容_CL21B105KBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KBFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-124511.45 MB36页61
IC封装资料_电容_CL10B105KQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-125731.45 MB36页192
IC封装资料_电容_CL21B105KBFNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KBFNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-126121.45 MB36页173
IC封装资料_电容_0805CG300J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125791.05 MB27页258
IC封装资料_电容_GRM1885C1H7R5CA01D.pdf
GRM1885C1H7R5CA01_(0603,C0G:EIA,7.5pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121618944.11 KB30页137
IC封装资料_电容_CL21B106KOQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1212401.42 MB36页84
IC封装资料_电感_YNR4030-1R0M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12455664.95 KB5页230
IC封装资料_电容_CL21B105KPFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1215841.46 MB36页224
IC封装资料_电源管理芯片_MC78M05BDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2016March,2016−Rev.281PublicationOrderNumber:MC78M00/DMC78M00,MC78M00A,NCV78M00Series500m...
2024-12-121006222.17 KB15页84
IC封装资料_电容_CC0402CRNPO9BN2R2.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12112217.81 MB176页258
IC封装资料_电容_GRM155R71C683KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1265920.26 KB29页60
IC封装资料_电容_CL10B105KQ8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KQ8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-12964361.82 KB3页1
IC封装资料_电容_0805CG301J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127131.05 MB27页24
IC封装资料_电感_YNR4030-1R5M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12643664.95 KB5页89
IC封装资料_连接器_1830677.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12152536.13 MB445页28
IC封装资料_电源管理芯片_MC7805CDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2014November,2014−Rev.271PublicationOrderNumber:MC7800/DMC7800,MC7800A,MC7800AE,NCV78001....
2024-12-121255296.53 KB31页13
IC封装资料_电源管理芯片_MC7805BDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2014November,2014−Rev.271PublicationOrderNumber:MC7800/DMC7800,MC7800A,MC7800AE,NCV78001....
2024-12-12677296.53 KB31页68
IC封装资料_电容_GRM155R71C822KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121447920.26 KB29页76
IC封装资料_电容_CL10B105MO8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121459259.58 KB3页78

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