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IC封装资料_电容_0805CG330J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124551.05 MB27页227
IC封装资料_电感_YNR4030-2R2M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121442664.95 KB5页22
IC封装资料_电容_CL10B105MQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105MQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215201.45 MB36页217
IC封装资料_电容_GRM1885C1H8R0BA01D.pdf
GRM1885C1H8R0BA01_(0603,C0G:EIA,8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121130944.11 KB30页219
IC封装资料_电感_YNR4030-3R3M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12466664.95 KB5页113
IC封装资料_电容_GRM1885C1H7R5DA01D.pdf
GRM1885C1H7R5DA01_(0603,C0G:EIA,7.5pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121238944.09 KB30页131
IC封装资料_电源管理芯片_MC7815BDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2014November,2014−Rev.271PublicationOrderNumber:MC7800/DMC7800,MC7800A,MC7800AE,NCV78001....
2024-12-121121296.53 KB31页233
IC封装资料_电容_CL21B153KBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-129947.46 MB84页152
IC封装资料_电源管理芯片_MC7812BDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2014November,2014−Rev.271PublicationOrderNumber:MC7800/DMC7800,MC7800A,MC7800AE,NCV78001....
2024-12-1286296.53 KB31页117
IC封装资料_电容_GRM155R71E103JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12695920.26 KB29页107
IC封装资料_电容_GRM1885C1H8R0DA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121931944.07 KB30页285
IC封装资料_电容_CL10B121KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12753259.58 KB3页277
IC封装资料_电容_GRM1885C1H8R0CA01D.pdf
GRM1885C1H8R0CA01_(0603,C0G:EIA,8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12182944.08 KB30页23
IC封装资料_电容_CL10B106MQ8NRNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12483259.58 KB3页122
IC封装资料_电容_CL21B222KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-123831.45 MB36页115
IC封装资料_电容_CL21B221KCANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B221KCANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12233368.86 KB3页237
IC封装资料_电容_0805CG332J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121701.05 MB27页264
IC封装资料_电容_CL21B221KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B221KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12716360.66 KB3页260
IC封装资料_电容_0805CG331J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127441.05 MB27页131
IC封装资料_电容_CL21B201KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-124361.45 MB36页82

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