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IC封装资料_电容_SPZ0JM471E09C30R.pdf
|A川川I~'jI~.~盯ROLYTICCAPACITORSAiSH~PartNumberingSystem日E回8:liJ囚lli囚~回113114国回①Category∞deCodeTypeEle恼。IyticCspacitor...
2024-12-126936.41 MB11页206
IC封装资料_电容_GRM188R71E104JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12256944.07 KB30页53
IC封装资料_电容_CL10B561JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B561JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121337360.63 KB3页58
IC封装资料_电容_EWH1CM331F11OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1273315.39 MB230页188
IC封装资料_电容_CL10B511KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12513259.58 KB3页103
IC封装资料_电容_1206CG3R3C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216531.05 MB27页259
IC封装资料_电感_YPRH105R-220M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12871765.25 KB5页213
IC封装资料_电感_YPRH105R-151M.pdf
SMDPowerInductors-YPRH105RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-12473765.25 KB5页266
IC封装资料_连接器_DF12E_5.0_-30DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121011288.67 KB11页93
IC封装资料_电源管理芯片_TL431BIDBZR_215.pdf
TL431familyAdjustableprecisionshuntregulatorsRev.6—9January2019Productdatasheet1.Productprofile1.1.GeneraldescriptionThree-termin...
2024-12-121640508.79 KB19页147
IC封装资料_连接器_DF12E_5.0_-20DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12506288.67 KB11页10
IC封装资料_连接器_DF12E_4.0_-60DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121113288.67 KB11页253
IC封装资料_电源管理芯片_TL431BCDBZRVL.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-12743278.43 KB28页70
IC封装资料_连接器_DF12E_4.0_-50DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121191288.67 KB11页185
IC封装资料_电容_GRM188R71E104KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12622944.07 KB30页12
IC封装资料_连接器_DF12E_5.0_-50DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12423288.67 KB11页65
IC封装资料_连接器_DF12E_5.0_-40DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121212288.67 KB11页115
IC封装资料_电容_CL10B561KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B561KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121724361.14 KB3页184
IC封装资料_连接器_DF12E_5.0_-36DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121810288.67 KB11页262
IC封装资料_电容_1206CG3R9C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122761.05 MB27页251

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