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IC封装资料_电源管理芯片_LTC3388EMSE-3_TRPBF.pdf
LTC3388-1/LTC3388-31338813faFormoreinformationwww.linear.com/LTC3388TYPICALAPPLICATIONFEATURESDESCRIPTION20VHighEfficiencyNanopowe...
2024-12-12292452.27 KB22页161
IC封装资料_电感_SWPA4018S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218651.32 MB22页282
IC封装资料_电容_CL10A225KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121572259.57 KB3页13
IC封装资料_连接器_1757381.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1245136.13 MB445页185
IC封装资料_电容_0805B223K251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124521.26 MB20页74
IC封装资料_电感_SWPA6045S2R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218451.32 MB22页214
IC封装资料_电源管理芯片_LTC3891EFE_TRPBF.pdf
LTC389113891faTYPICALAPPLICATIONFEATURESDESCRIPTIONLowIQ,60VSynchronousStep-DownControllerTheLTC®3891isahighperformancestep-downs...
2024-12-121151754.75 KB32页6
IC封装资料_电源管理芯片_LTC3890IGN-1_TRPBF.pdf
LTC3890-1138901fbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION60VLowIQ,Dual,2-PhaseSynchronousStep-DownDC/DCControllerHighEffi...
2024-12-121165955.88 KB36页151
IC封装资料_电容_GRM155R60J105KE19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121572920.26 KB29页137
IC封装资料_电容_CL10A225KP8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KP8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1213711.42 MB36页109
IC封装资料_电容_0805B223K251NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128621.05 MB27页278
IC封装资料_电源管理芯片_LTC3400BES6_TRPBF.pdf
LTC3400/LTC3400B13400faIPagersIMP3PlayersIDigitalCamerasILCDBiasSuppliesIHandheldInstrumentsIWirelessHandsetsIGPSReceiversIUpto92%...
2024-12-12850301.87 KB12页212
IC封装资料_电感_SWPA6045S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213191.32 MB22页213
IC封装资料_电源管理芯片_LTC3388IDD-3_PBF.pdf
LTC3388-1/LTC3388-31338813faFormoreinformationwww.linear.com/LTC3388TYPICALAPPLICATIONFEATURESDESCRIPTION20VHighEfficiencyNanopowe...
2024-12-121074452.27 KB22页296
IC封装资料_电容_CL03C1R5BB3GNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127837.46 MB84页102
IC封装资料_电容_GRM155R60J105ME19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121504920.26 KB29页263
IC封装资料_电容_CL10A225KP8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KP8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-129361.42 MB36页235
IC封装资料_电容_0603N471J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218051.26 MB20页278
IC封装资料_电容_0805B223K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125671.26 MB20页43
IC封装资料_电容_0603N471J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-128461.26 MB20页59

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