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IC封装资料_电感_SWPA6045S1R5NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211521.32 MB22页10
IC封装资料_电感_SWPA4018S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121091.32 MB22页31
IC封装资料_电容_0603N470J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214211.26 MB20页234
IC封装资料_电容_CL10A225KP8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KP8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-123891.42 MB36页233
IC封装资料_电感_SWPA4018S6R8MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127261.32 MB22页224
IC封装资料_电源管理芯片_LTC3890IGN-1_PBF.pdf
LTC3890-1138901fbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION60VLowIQ,Dual,2-PhaseSynchronousStep-DownDC/DCControllerHighEffi...
2024-12-121213955.88 KB36页270
IC封装资料_电源管理芯片_LTC3388EMSE-3_TRPBF.pdf
LTC3388-1/LTC3388-31338813faFormoreinformationwww.linear.com/LTC3388TYPICALAPPLICATIONFEATURESDESCRIPTION20VHighEfficiencyNanopowe...
2024-12-12292452.27 KB22页161
IC封装资料_电感_SWPA4018S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218651.32 MB22页282
IC封装资料_电容_CL10A225KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121572259.57 KB3页13
IC封装资料_连接器_1757381.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1245136.13 MB445页185
IC封装资料_电容_0805B223K251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124521.26 MB20页74
IC封装资料_电感_SWPA6045S2R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218451.32 MB22页214
IC封装资料_电源管理芯片_LTC3891EFE_TRPBF.pdf
LTC389113891faTYPICALAPPLICATIONFEATURESDESCRIPTIONLowIQ,60VSynchronousStep-DownControllerTheLTC®3891isahighperformancestep-downs...
2024-12-121151754.75 KB32页6
IC封装资料_电源管理芯片_LTC3890IGN-1_TRPBF.pdf
LTC3890-1138901fbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION60VLowIQ,Dual,2-PhaseSynchronousStep-DownDC/DCControllerHighEffi...
2024-12-121165955.88 KB36页151
IC封装资料_电容_GRM155R60J105KE19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121572920.26 KB29页137
IC封装资料_电容_CL10A225KP8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KP8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1213711.42 MB36页109
IC封装资料_电容_0805B223K251NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128621.05 MB27页278
IC封装资料_电源管理芯片_LTC3400BES6_TRPBF.pdf
LTC3400/LTC3400B13400faIPagersIMP3PlayersIDigitalCamerasILCDBiasSuppliesIHandheldInstrumentsIWirelessHandsetsIGPSReceiversIUpto92%...
2024-12-12850301.87 KB12页212
IC封装资料_电感_SWPA6045S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213191.32 MB22页213
IC封装资料_电源管理芯片_LTC3388IDD-3_PBF.pdf
LTC3388-1/LTC3388-31338813faFormoreinformationwww.linear.com/LTC3388TYPICALAPPLICATIONFEATURESDESCRIPTION20VHighEfficiencyNanopowe...
2024-12-121074452.27 KB22页296

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