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IC封装资料_电源管理芯片_LTC3899IUHF_PBF.pdf
LTC389913899faFormoreinformationwww.linear.com/LTC3899TYPICALAPPLICATIONFEATURESDESCRIPTION60VLowIQ,TripleOutput,Buck/Buck/BoostSy...
2024-12-12649994.13 KB38页289
IC封装资料_电容_CL03C2R2BA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-129911.4 MB36页77
IC封装资料_电容_GRM155R60J155ME80D.pdf
ChipMultilayerCeramicCapacitorsforGeneralPurposeGRM155R60J155ME80_(0402,X5R(EIA),1.5uF,DC6.3V)_:PackagingCodeReferenceSheet■Scope...
2024-12-121600899.99 KB30页136
IC封装资料_电容_0603N561J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129101.26 MB20页278
IC封装资料_电容_CL10A225KQ8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KQ8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1213731.42 MB36页196
IC封装资料_电感_SWPA4018S221MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121921.32 MB22页55
IC封装资料_电源管理芯片_LTC3406BES5_TRPBF.pdf
1LTC3406B3406bfa■HighEfficiency:Upto96%■600mAOutputCurrentatVIN=3V■2.5Vto5.5VInputVoltageRange■1.5MHzConstantFrequencyOperatio...
2024-12-12289319.31 KB16页4
IC封装资料_电容_CL03C3R3BA3GNNC.pdf
SPECIFICATIONSupplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CAP,3.3,25V,±0.1,C0G,0201...
2024-12-125341.55 MB36页221
IC封装资料_电容_0805B224K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218711.05 MB27页69
IC封装资料_电感_SWPA6045S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128721.32 MB22页179
IC封装资料_电容_0603N680G101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-123231.26 MB20页290
IC封装资料_电感_SWPA4018S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-123031.32 MB22页292
IC封装资料_连接器_1758092.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1254636.13 MB445页80
IC封装资料_电源管理芯片_LTC3406ES5-1.8_TRPBF.pdf
1LTC3406LTC3406-1.5/LTC3406-1.83406fa■HighEfficiency:Upto96%■VeryLowQuiescentCurrent:Only20µADuringOperation■600mAOutputCurren...
2024-12-121471324.31 KB16页257
IC封装资料_电容_GRM21BR71E225KE11L.pdf
GRM21BR71E225KE11_(0805,X7R:EIA,2.2uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12676916.49 KB29页23
IC封装资料_电容_CL03C8R2CA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-1219191.4 MB36页60
IC封装资料_电容_CL03C3R3CA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-1214941.4 MB36页166
IC封装资料_电容_0603N680J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1216261.26 MB20页198
IC封装资料_电感_SWPA4018S470MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121501.32 MB22页225
IC封装资料_电源管理芯片_LTC3407AEDD-2_TRPBF.pdf
LTC3407A-213407a2f■HighEfficiency:Upto95%■LowRipple(<35mVPK-PK)BurstModeOperation;IQ=40μA■2.25MHzConstantFrequencyOperation■N...
2024-12-12258358.76 KB16页120

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