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IC封装资料_电感_SWPA4018SR47NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-12641.32 MB22页174
IC封装资料_电容_CL10A225MP8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225MP8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217261.42 MB36页146
IC封装资料_连接器_1757491.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/4-GOrderNo.:1757491Thefiguresh...
2024-12-12885229.22 KB5页23
IC封装资料_电源管理芯片_LTC4002EDD-8.4_TRPBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-121087253.54 KB16页17
IC封装资料_电源管理芯片_LTC4002EDD-4.2_TRPBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-12721253.54 KB16页242
IC封装资料_电源管理芯片_LTC3407EDD-4_TRPBF.pdf
LTC3407-4134074faTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONDualSynchronous,800mA,2.25MHzStep-DownDC/DCRegulatorTheLTC®3407...
2024-12-12412351.33 KB16页114
IC封装资料_电容_0603X105K100CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217861.26 MB20页185
IC封装资料_电容_CL10A225MQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225MQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-123611.42 MB36页103
IC封装资料_连接器_1757501.pdf
PHOENIXCONTACTInc.,USAPage1/6http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/5-GOrderNo.:1757501Thefiguresh...
2024-12-12292400.85 KB6页299
IC封装资料_电容_0805B271K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128931.05 MB27页167
IC封装资料_电源管理芯片_LTC3407EMSE_TRPBF.pdf
LTC340713407faTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONDualSynchronous,600mA,1.5MHzStep-DownDC/DCRegulatorTheLTC®3407isad...
2024-12-12439301.89 KB16页291
IC封装资料_电容_0603X105K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210821.05 MB27页41
IC封装资料_电感_SWPA6045S120MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128891.32 MB22页25
IC封装资料_电感_SWPA4020S1R5NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213111.32 MB22页88
IC封装资料_电源管理芯片_LTC4002ES8-4.2_PBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-121693253.54 KB16页193
IC封装资料_连接器_1757527.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/8-GOrderNo.:1757527Thefiguresh...
2024-12-121347229.53 KB5页69
IC封装资料_连接器_1757514.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/6-GOrderNo.:1757514Thefiguresh...
2024-12-121629229.22 KB5页253
IC封装资料_电容_CL10A226KQ8NRNE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121215259.58 KB3页241
IC封装资料_电容_0402N470G500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1213151.26 MB20页50
IC封装资料_电容_CL10A225MQ8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225MQ8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121178360.84 KB3页255

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