拖动LOGO至书签栏，立即收藏五八文库

首页
文档
中小学卷
语文试卷数学试卷英语试卷物理试卷化学试卷政治试卷历史试卷地理试卷生物试卷其他科目
教育资料
电商大学教学幼儿园小学初中高中
技能考试
公务员考试考研考博职业考证学历提升自学考试成人高考校园招聘普通话考试司法考试专业技能证书考试建筑工程考试外贸类考试医学护理类考试财会金融考试导游证考试社会工作者考试人力资源管理师考试心理咨询师考试教师招聘考试教师资格证计算机类考试全国翻译资格水平考试托福考试雅思口语考试专八英语考试专四英语考试大学英语四级大学英语六级公安类结构化面试公安专业国考省考军队文职考试银行招聘考试国考银保监会三支一扶考试事业单位考试公务员遴选公务员考试研究生考试港奥台华侨生联考体育单招考试
模板
安全生产财税公检法合同简历医疗总结汇报其他模板党政范文企业管理毕业答辩方案作文论文标准规范讲话稿
软件
常用软件量产开卡工具实用工具电路图固件施工图 IC资料
文章
问答
专题

添加五八文库到电脑桌面

已经有10万+用户把五八文库添加到电脑桌面，以后点击桌面图标一键打开，无需搜索，非常快捷！

开通会员限时优惠

登录 | 注册

软件

分类:

类型:

IC封装资料_电容_0805B823K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219701.26 MB20页74
IC封装资料_电容_C3216X7R1E335KT000N.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-122651.61 MB56页159
IC封装资料_接口及驱动芯片_NXP74VCH2T45.pdf
1.GeneraldescriptionThe74AVCH2T45isadualbit,dualsupplytransceiverthatenablesbidirectionalleveltranslation.Itfeaturestwodatainput-o...
2024-12-12308232.07 KB29页216
IC封装资料_电感_WPN4020H6R8MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12406624.92 KB9页114
IC封装资料_接口及驱动芯片_NXB0104GU12X.pdf
NXB0104Dualsupplytranslatingtransceiver;autodirectionsensing;3-stateRev.1—11September2019Productdatasheet1.GeneraldescriptionTheN...
2024-12-12470422.18 KB25页99
IC封装资料_电源管理芯片_LTC4417CUF_PBF.pdf
LTC441714417fTypicalapplicaTionFeaTuresDescripTionPrioritizedPowerPath™ControllerTheLTC®4417connectsoneofthreevalidpowersupplies...
2024-12-121271515.8 KB32页155
IC封装资料_电容_CL10F224ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1216411.42 MB36页102
IC封装资料_电容_GRM155R61E224KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121850920.26 KB29页237
IC封装资料_电容_C3216X7S2A225KT000N.pdf
COM-GEN-006DELIVERYSPECIFICATIONSPEC.No.C-General-fDATE:Aug,2019ToUpontheacceptanceofthisspec.previousspec.(C2011-0454)shallbeabol...
2024-12-121781.79 MB37页68
IC封装资料_接口及驱动芯片_SN74LVC1T45DCKR.pdf
BDIR54A3VCCAVCCBProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisdatasheetaddr...
2024-12-1219301.64 MB35页167
IC封装资料_电容_CL10B103KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121321259.58 KB3页91
IC封装资料_电容_CL10F224ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-122951.42 MB36页99
IC封装资料_电容_0805CG0R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212441.05 MB27页247
IC封装资料_电容_CL10F224ZA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-129441.42 MB36页35
IC封装资料_电感_WPN201610H1R0MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12485624.92 KB9页56
IC封装资料_电容_C3225X5R0J107M250AC.pdf
SeriesNameCaseSizeCodeTemperatureCharacteristicsRatedVoltageCodeCapacitanceToleranceThicknessCodePackagingCodeSpecialCodeDescripti...
2024-12-1271463.62 KB3页22
IC封装资料_电感_WPN4020H100MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121931624.92 KB9页83
IC封装资料_电容_GRM1555C1H560GA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12173710.43 MB296页8
IC封装资料_电源管理芯片_LTC4417CUF_TRPBF.pdf
LTC441714417fTypicalapplicaTionFeaTuresDescripTionPrioritizedPowerPath™ControllerTheLTC®4417connectsoneofthreevalidpowersupplies...
2024-12-12645515.8 KB32页74
IC封装资料_电容_0805CG1R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125791.05 MB27页258

首页上页 308 309 310 311 312 下页尾页

确认删除?