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IC封装资料_电感_WPN201610H1R5MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12909624.92 KB9页252
IC封装资料_接口及驱动芯片_SN74LVC2T45DCU.pdf
B1DIR57A12VCCAVCCBB26A23ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisdatas...
2024-12-122711.19 MB31页85
IC封装资料_电源管理芯片_LTC4417IUF_PBF.pdf
LTC441714417fTypicalapplicaTionFeaTuresDescripTionPrioritizedPowerPath™ControllerTheLTC®4417connectsoneofthreevalidpowersupplies...
2024-12-121898515.8 KB32页222
IC封装资料_电容_C3225X5R1E106KTJ00E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-129771.61 MB56页239
IC封装资料_接口及驱动芯片_SN74LVC16T245DGGR.pdf
ToSevenOtherChannels1DIR1A11B11OEToSevenOtherChannels2DIR2A12B12OE14724364822513ProductFolderSample&BuyTechnicalDocumentsTools&Sof...
2024-12-1216301.28 MB34页251
IC封装资料_电感_WPN201610H2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121050624.92 KB9页46
IC封装资料_电容_CL10F225ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121102259.58 KB3页69
IC封装资料_电容_GRM155R61E225KE11D.pdf
GRM155R61E225KE11_(0402,X5R:EIA,2.2uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12909923.09 KB29页74
IC封装资料_电容_CL10F224ZO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121456360.68 KB3页141
IC封装资料_电容_0805CG1R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121001.05 MB27页261
IC封装资料_电容_CL10F224ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12875259.58 KB3页191
IC封装资料_电容_C3225X7R1C106KT000N.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-126021.61 MB56页188
IC封装资料_晶体管_BSS138LT1G.pdf
©SemiconductorComponentsIndustries,LLC,2016March,2019−Rev.121PublicationOrderNumber:BSS138LT1/DBSS138L,BVSS138LPowerMOSFET200mA,...
2024-12-12545194.23 KB6页68
IC封装资料_电感_WPN201610H4R7MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121997624.92 KB9页82
IC封装资料_电源管理芯片_LTC4425EMSE_TRPBF.pdf
LTC442514425faFormoreinformationwww.linear.com/LTC4425TypicalapplicaTionFeaTuresDescripTionLinearSuperCapChargerwithCurrent-Limite...
2024-12-12332721 KB22页96
IC封装资料_晶体管_BSP52T1G.pdf
©SemiconductorComponentsIndustries,LLC,2012January,2012−Rev.81PublicationOrderNumber:BSP52T1/DBSP52T1G,BSP52T3GNPNSmall-SignalDa...
2024-12-121282173.77 KB5页161
IC封装资料_接口及驱动芯片_TXB0104RUTR.pdf
ProcessorPeripheralVCCAVCCBProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisda...
2024-12-1218081.45 MB41页12
IC封装资料_电容_CL10B103KB8WPNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1215347.55 MB84页20
IC封装资料_电容_GRM1555C1H560JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12696920.26 KB29页236
IC封装资料_电容_CL10F333ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F333ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12843360.23 KB3页210

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