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IC封装资料_晶体管_ULN2001AD.pdf
7C6C5C4C3C2C1CCOM76543217B6B5B4B3B2B1B101112131415169ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMP...
2024-12-126281.39 MB35页263
IC封装资料_电容_GRM1555C1H620JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12230920.26 KB29页14
IC封装资料_电容_CL10B103KC8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103KC8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121810404.62 KB3页27
IC封装资料_电容_CL10F393ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F393ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121097360.43 KB3页101
IC封装资料_电容_CL10F334ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-1266259.58 KB3页196
IC封装资料_电容_CL10B103KB85PND.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KB85PND●Product:Multi-layerCeramicCapacitorCAP,10㎋,50V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121302269.02 KB3页37
IC封装资料_电容_CC0100KRX5R5BB103.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-127761.22 MB13页22
IC封装资料_电容_0805CG2R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212851.05 MB27页175
IC封装资料_晶体管_ULN2003AIPW.pdf
7C6C5C4C3C2C1CCOM76543217B6B5B4B3B2B1B101112131415169ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMP...
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IC封装资料_晶体管_ULN2003AINSR.pdf
7C6C5C4C3C2C1CCOM76543217B6B5B4B3B2B1B101112131415169ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMP...
2024-12-1213081.39 MB35页55
IC封装资料_电容_0805CG2R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127461.05 MB27页132
IC封装资料_电容_CL10F473ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F473ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121531360.59 KB3页216
IC封装资料_电容_CL10F473ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F473ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121486360.61 KB3页204
IC封装资料_电感_WPN201612H2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12548624.92 KB9页24
IC封装资料_电容_CC0201BRNPO9BNR30.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12921998.46 KB11页66
IC封装资料_电容_CL10B103KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121603259.58 KB3页126
IC封装资料_晶体管_ULN2003AJ.pdf
7C6C5C4C3C2C1CCOM76543217B6B5B4B3B2B1B101112131415169ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMP...
2024-12-1216231.39 MB35页150
IC封装资料_电容_0805CG2R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125591.05 MB27页149
IC封装资料_电容_GRM1555C1H621JA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12145010.43 MB296页183
IC封装资料_电感_WPN252010H1R0MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121999624.92 KB9页65

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