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IC封装资料_电容_0805F333M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211411.05 MB27页121
IC封装资料_连接器_1935200.pdf
https://www.phoenixcontact.com/us/products/193520008/04/2015Page1/6PCBterminalblock-PT1,5/6-5,0-H-1935200Pleasebeinformedthattheda...
2024-12-121090172.21 KB6页150
IC封装资料_电容_0805F273M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217771.05 MB27页60
IC封装资料_连接器_1935190.pdf
https://www.phoenixcontact.com/us/products/193519008/04/2015Page1/6PCBterminalblock-PT1,5/5-5,0-H-1935190Pleasebeinformedthattheda...
2024-12-121322172.22 KB6页259
IC封装资料_连接器_1935187.pdf
https://www.phoenixcontact.com/us/products/193518708/04/2015Page1/6PCBterminalblock-PT1,5/4-5,0-H-1935187Pleasebeinformedthattheda...
2024-12-121565172.17 KB6页257
IC封装资料_电感_YNR6045-152M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121321672.55 KB6页165
IC封装资料_电感_YNR6045-151M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121553672.55 KB6页287
IC封装资料_电容_GRM1885C1H360GA01D.pdf
GRM1885C1H360GA01_(0603,C0G:EIA,36pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121600944.09 KB30页218
IC封装资料_电源管理芯片_MP2143.pdf
MP21433A,5.5V,1.2MHz,40μAIQ,COTSynchronousStepDownSwitcherMP2143Rev.1.07www.MonolithicPower.com17/4/2016MPSProprietaryInformation...
2024-12-12910559.14 KB14页266
IC封装资料_电容_CL21C472JBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1212541.39 MB36页174
IC封装资料_电源管理芯片_MP2012DQ-LF-Z.pdf
MP2012LowVoltage,2.7-6VInput,1.5A,1.2MHzSynchronousStep-DownConverterMP2012Rev.1.01www.MonolithicPower.com19/22/2011MPSProprietary...
2024-12-12560847.25 KB10页272
IC封装资料_电容_CL21C471JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128001.45 MB36页79
IC封装资料_连接器_1935213.pdf
https://www.phoenixcontact.com/us/products/193521308/04/2015Page1/6PCBterminalblock-PT1,5/7-5,0-H-1935213Pleasebeinformedthattheda...
2024-12-12851172.23 KB6页13
IC封装资料_电容_GRM155R71H272KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12943920.26 KB29页1
IC封装资料_电容_GRM1885C1H360JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121302944.07 KB30页32
IC封装资料_电容_CL21C510JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121921315.92 KB3页225
IC封装资料_电容_CL10B222KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B222KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-127861.45 MB36页257
IC封装资料_电容_CL21C620JBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-12907.46 MB84页128
IC封装资料_电容_0805F334M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216691.05 MB27页170
IC封装资料_电感_YNR6045-221M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121336672.55 KB6页52

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