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IC封装资料_电容_CL21C820JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210071.45 MB36页230
IC封装资料_电容_CL21C750JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-124051.45 MB36页169
IC封装资料_连接器_1935307.pdf
https://www.phoenixcontact.com/us/products/193530708/04/2015Page1/6PCBterminalblock-PT1,5/16-5,0-H-1935307Pleasebeinformedthatthed...
2024-12-121690172.21 KB6页256
IC封装资料_连接器_1935297.pdf
https://www.phoenixcontact.com/us/products/193529708/04/2015Page1/6PCBterminalblock-PT1,5/15-5,0-H-1935297Pleasebeinformedthatthed...
2024-12-121378172.23 KB6页265
IC封装资料_连接器_1935284.pdf
https://www.phoenixcontact.com/us/products/193528408/04/2015Page1/6PCBterminalblock-PT1,5/14-5,0-H-1935284Pleasebeinformedthatthed...
2024-12-12259172.18 KB6页62
IC封装资料_电容_GRM1885C1H390JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12680944.07 KB30页273
IC封装资料_电容_CL21F104ZBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128791.45 MB36页256
IC封装资料_电源管理芯片_MP2143DJ-LF-Z.pdf
MP21433A,5.5V,1.2MHz,40μAIQ,COTSynchronousStepDownSwitcherMP2143Rev.1.07www.MonolithicPower.com17/4/2016MPSProprietaryInformation...
2024-12-12572564.87 KB14页48
IC封装资料_电容_GRM155R71H273KE14D.pdf
GRM155R71H273KE14_(0402,X7R:EIA,27000pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-121961924.66 KB29页104
IC封装资料_连接器_5103308-5.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121657190.54 KB1页238
IC封装资料_连接器_5103308-3.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121060190.54 KB1页218
IC封装资料_电容_CL10B222KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B222KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121047361.48 KB3页131
IC封装资料_连接器_5103308-2.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121669190.54 KB1页187
IC封装资料_连接器_5103308-1.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12506190.54 KB1页219
IC封装资料_电容_CL10B222KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12972259.58 KB3页10
IC封装资料_电容_GRM1885C1H392JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12547944.07 KB30页22
IC封装资料_电容_GRM1885C1H391JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12994944.07 KB30页210
IC封装资料_电容_0805F393M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212801.05 MB27页125
IC封装资料_电感_YNR6045-222M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12152672.55 KB6页77
IC封装资料_电容_CL21F105ZBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1214061.46 MB36页126

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