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IC封装资料_电容_GRM155R61A224KE19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12499920.26 KB29页259
IC封装资料_电容_CL10C471JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12740316.29 KB3页249
IC封装资料_电容_C823A104J90C000.pdf
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2024-12-1217132.9 MB5页194
IC封装资料_电容_CL10A475MP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12530259.58 KB3页211
IC封装资料_电容_CL10A475MP5LNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12398259.58 KB3页292
IC封装资料_连接器_1804881.pdf
https://www.phoenixcontact.com/pi/products/180488104/09/2019Page1/4Printed-circuitboardconnector-PC4/11-G-7,62-1804881Pleasebeinfo...
2024-12-121441218.83 KB4页241
IC封装资料_连接器_1804878.pdf
https://www.phoenixcontact.com/us/produkte/180487819.10.2012Page1/7Basestrip-PC4/10-G-7,62-1804878Pleasebeinformedthatthedatashown...
2024-12-121836210.29 KB7页138
IC封装资料_电容_0805B471K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214271.05 MB27页263
IC封装资料_电阻_RC0201JR-070RL.pdf
DATASHEETGENERALPURPOSECHIPRESISTORSRC_Lseries±0.1%,±0.5%,±1%,±5%Sizes0075/0100/0201/0402/0603/0805/1206/1210/1218/2010/2512Ro...
2024-12-1210231.05 MB10页212
IC封装资料_电阻_MO1WS205XT52.pdf
VER:01规格承认书SPECIFICATIONFORAPPROVAL客户CUSTOMER：适用所有品名PRODUCT：不燃性金属氧化膜电阻器系列规格TYPE：MO1/4W-7WS客户承认...
2024-12-12472814.62 KB9页205
IC封装资料_电感_SWPA8065S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1216491.32 MB22页56
IC封装资料_电容_CL10C471JB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12522259.58 KB3页180
IC封装资料_电源管理芯片_LTC4218IGN_TRPBF.pdf
LTC421814218fhFormoreinformationwww.linear.com/LTC4218FeaturesapplicationsDescriptionHotSwapControllerTheLTC®4218isaHotSwapcontro...
2024-12-121745397.35 KB18页214
IC封装资料_电容_CL10C471JB8NNWC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-122541.42 MB36页118
IC封装资料_电容_C823D123J60Q350.pdf
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2024-12-1212952.9 MB5页177
IC封装资料_电容_CL10A475MQ5LNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12703259.58 KB3页188
IC封装资料_电容_0805B472K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1213551.26 MB20页293
IC封装资料_电容_C823A222J40C000.pdf
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2024-12-127402.9 MB5页205
IC封装资料_电容_0805B471K501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217081.26 MB20页287
IC封装资料_连接器_1806229.pdf
https://www.phoenixcontact.com/us/produkte/180622919.10.2012Page1/6Basestrip-GMSTB2,5/2-GF-7,62-1806229Pleasebeinformedthatthedata...
2024-12-12370186.49 KB6页177

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