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IC封装资料_电源管理芯片_LTC4263CDE-1_TRPBF.pdf
LTC4263-1142631faTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONHighPowerSinglePSEControllerwithInternalSwitchTheLTC®4263-1isah...
2024-12-12246371.4 KB20页298
IC封装资料_电阻_RC0603JR-0710KL.pdf
DATASHEETGENERALPURPOSECHIPRESISTORSRC_Lseries±0.1%,±0.5%,±1%,±5%Sizes0075/0100/0201/0402/0603/0805/1206/1210/1218/2010/2512Ro...
2024-12-129081.06 MB10页3
IC封装资料_电容_GRM155R61A225ME95D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12986920.26 KB29页107
IC封装资料_电容_CL10C471KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121729316.52 KB3页98
IC封装资料_电容_CL10A476MR8NZNE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12860259.58 KB3页23
IC封装资料_电容_CL10C471JE8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12442316.34 KB3页269
IC封装资料_电容_C823D822J60Q350.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-129722.9 MB5页286
IC封装资料_电容_0805B472K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-123651.26 MB20页110
IC封装资料_连接器_1806287.pdf
https://www.phoenixcontact.com/us/produkte/180628719.10.2012Page1/6Basestrip-GMSTB2,5/8-GF-7,62-1806287Pleasebeinformedthatthedata...
2024-12-12568186.6 KB6页140
IC封装资料_电感_SWPA252010S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1216211.32 MB22页208
IC封装资料_连接器_1806274.pdf
https://www.phoenixcontact.com/us/products/180627410/27/2014Page1/5Basestrip-GMSTB2,5/7-GF-7,62-1806274Pleasebeinformedthatthedata...
2024-12-12306171.43 KB5页21
IC封装资料_电阻_RN14W1KFTBA1.pdf
21ReferenceStandardsIEC60115-1JISC5201-1RNseriesPRECISIONMETALFILMRESISTORSELECTRICALANDMECHANICALPERFORMANCEENVIRONMENTALCHARACTE...
2024-12-121501497.45 KB2页283
IC封装资料_电感_SWPA252010S1R5NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129121.32 MB22页131
IC封装资料_电阻_RLP25FEER003.pdf
HighPowerCurrentSensingResistorsRLPSeries(Halogen-Free)AEC-Q200-VerDqualifiedDocumentNoTRLP-250S008FIssueddate2016/10/11page1/6TA-...
2024-12-12114530.31 KB6页84
IC封装资料_电源管理芯片_LTC4267CGN_TRPBF.pdf
LTC426714267fcPoweroverEthernetIEEE802.3afPDInterfacewithIntegratedSwitchingRegulatorTheLTC®4267combinesanIEEE802.3afcompliantPow...
2024-12-1211872.08 MB32页7
IC封装资料_电容_GRM1555C1H151JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12932920.26 KB29页111
IC封装资料_电容_CL10C510JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12975259.57 KB3页172
IC封装资料_电容_GRM155R61A274KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1254920.26 KB29页278
IC封装资料_电容_CL10C500JC81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121237259.57 KB3页59
IC封装资料_连接器_1806300.pdf
https://www.phoenixcontact.com/us/products/180630010/27/2014Page1/5Basestrip-GMSTB2,5/10-GF-7,62-1806300Pleasebeinformedthatthedat...
2024-12-12341171.71 KB5页113

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