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IC封装资料_电容_CL10B102KB85PNL.pdf
●Supplier:SamsungElectro-MechanicsCL10B102KB85PNL●Product:Multi-layerCeramicCapacitorCAP,1㎋,50V,±10%,X7R,0603●AEC-Q200Qualifi...
2024-12-1214815.87 MB36页93
IC封装资料_电源管理芯片_LTC4357IDCB_TRPBF.pdf
LTC43574357fdFeaturesapplicationsDescriptionPositiveHighVoltageIdealDiodeControllerTheLTC®4357isapositivehighvoltageidealdiodecon...
2024-12-12181840.98 KB14页121
IC封装资料_电容_0805B561K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216751.05 MB27页161
IC封装资料_连接器_1758131.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12107836.13 MB445页281
IC封装资料_过流保护_RL16-200.pdf
PositiveThermalCoefficient(PTC)RL16SeriesSpecificationsaresubjecttochangewithoutnotice.Pleaserefertohttp://www.ruilon.com.cnforcur...
2024-12-121419328.49 KB4页74
IC封装资料_过流保护_0451005MRL.pdf
SurfaceMountFuses57©2009Littelfuse,Inc.Specificationsaresubjecttochangewithoutnotice.451/453SeriesNANO2®>VeryFast-Acting>451/453...
2024-12-127341.16 MB4页74
IC封装资料_电容_GRM1555C1H270GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1283920.26 KB29页262
IC封装资料_电容_GRM1555C1H270FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12626920.26 KB29页133
IC封装资料_电容_CL10C681JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121953316.29 KB3页202
IC封装资料_电容_CL10C681JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12520259.58 KB3页61
IC封装资料_电容_C1608X5R1A106K080AC.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-1210981.65 MB57页57
IC封装资料_电源管理芯片_LTC4357IMS8_PBF.pdf
LTC43574357fdFeaturesapplicationsDescriptionPositiveHighVoltageIdealDiodeControllerTheLTC®4357isapositivehighvoltageidealdiodecon...
2024-12-121576840.98 KB14页215
IC封装资料_过压保护_07D820K.pdf
MetalOxideVaristors07DSeriesSpecificationsaresubjecttochangewithoutnotice.Pleaserefertohttp://www.ruilon.com.cnforcurrentinformati...
2024-12-121875327.07 KB4页202
IC封装资料_过压保护_1SMA10CAT3.pdf
©SemiconductorComponentsIndustries,LLC,2006May,2006−Rev.91PublicationOrderNumber:1SMA10CAT3/D1SMA10CAT3Series400WattPeakPowerZen...
2024-12-1259146.91 KB5页255
IC封装资料_电容_CL10B102KC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121987259.58 KB3页58
IC封装资料_过流保护_RL30-250.pdf
PositiveThermalCoefficient(PTC)RL30SeriesSpecificationsaresubjecttochangewithoutnotice.Pleaserefertohttp://www.ruilon.com.cnforcur...
2024-12-121364347.65 KB4页176
IC封装资料_电容_GRM1555C1H270JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121240920.26 KB29页288
IC封装资料_电容_0805B562K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129721.05 MB27页287
IC封装资料_电容_CL10C681JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C681JB81PNC●Product:Multi-layerCeramicCapacitorCAP,680㎊,50V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-123245.8 MB36页88
IC封装资料_电感_TFM201610GHM-2R2MTAA.pdf
August2017INDUCTORSThin-filmmetalTFM201610GHMInductorsforPowerCircuitsTFM201610GHMtypeTFM-GHMseries更多资料下载请到五八文库wk.58sm...
2024-12-12313261.65 KB9页184

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