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IC封装资料_电源管理芯片_LTC4359IDCB_TRPBF.pdf
LTC43591Rev.EFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESDESCRIPTIONIdealDiodeControllerwithReverseI...
2024-12-1218791.3 MB20页236
IC封装资料_电容_CL10C820GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121855316.18 KB3页154
IC封装资料_电容_CL10C820FB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121044316.18 KB3页76
IC封装资料_电容_CL10B102KC85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121810452.9 KB21页185
IC封装资料_电容_C1608X7R1E105KT000N.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-1215151.61 MB56页277
IC封装资料_电容_CL10B102KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121161259.58 KB3页155
IC封装资料_电容_C1608X5R1E475KT000E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-123581.61 MB56页116
IC封装资料_电容_0805B563K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125981.05 MB27页249
IC封装资料_过压保护_RCLAMP1255P.pdf
PROTECTIONPRODUCTS1www.semtech.comPRELIMINARYPROTECTIONPRODUCTS-RailClamp®®®®®RClamp1255PLowCapacitanceRClamp®SurgeProtectio...
2024-12-12692351.58 KB10页1
IC封装资料_电感_VLCF5020T-2R2N2R6-1.pdf
INDUCTORSApril2016WoundFerriteVLCF5020-1InductorsforPowerCircuitsVLCF5020-1TypeVLCFSeries更多资料下载请到五八文库wk.58sms.com(2/9)...
2024-12-12294226.65 KB9页290
IC封装资料_电容_GRM1555C1H301JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1280920.26 KB29页222
IC封装资料_电容_CL10C820JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1215341.39 MB36页172
IC封装资料_电感_VLCF4020T-4R7N1R2.pdf
INDUCTORSApril2016��VLCF4020��VLCF4020�VLCF��更多资料下载请到五八文库wk.58sms.com(2/9)INDUCTORS20160411/i...
2024-12-121680295.24 KB9页210
IC封装资料_过压保护_RCLAMP3346P.pdf
RClamp3346PFinalDatasheetRev5.0Revisiondate10/5/2016www.semtech.com1of9SemtechFeatures•ESDprotectionforhigh-speeddatalinestoIEC...
2024-12-12903456.59 KB10页78
IC封装资料_电源管理芯片_LTC4359IMS8_PBF.pdf
LTC43591Rev.EFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESDESCRIPTIONIdealDiodeControllerwithReverseI...
2024-12-122131.3 MB20页69
IC封装资料_电容_CL10C820JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121042259.58 KB3页184
IC封装资料_电容_GRM155R61C224KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12684920.26 KB29页273
IC封装资料_电容_C1608X7R1H104K080AA.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-1216071.65 MB57页181
IC封装资料_过压保护_TVS0701DRBR.pdf
VoltageTime(�s)TraditionalTVSTIFlat-Clamp201030ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTN...
2024-12-1212711.2 MB21页205
IC封装资料_电容_CL10B102MB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102MB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121473360.81 KB3页184

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