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IC封装资料_电感_YNR3010-2R2M.pdf
SMDPowerInductors-YNR3010Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12515661.07 KB5页284
IC封装资料_连接器_2510S-4P.pdf
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2024-12-12627667.33 KB1页274
IC封装资料_电源管理芯片_LTM4627MPY_PBF.pdf
LTM462714627fcFormoreinformationwww.linear.com/LTM4627TYPICALAPPLICATIONDESCRIPTION15ADC/DCµModuleRegulatorTheLTM®4627isacomplet...
2024-12-12253651.21 KB32页262
IC封装资料_电容_GRM1555C2A101JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12711920.26 KB29页47
IC封装资料_电容_0805CG102K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1220001.05 MB27页194
IC封装资料_电容_CC0201KRX5R6BB333.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12168998.46 KB11页201
IC封装资料_电感_YNR3010-3R3M.pdf
SMDPowerInductors-YNR3010Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12440661.07 KB5页268
IC封装资料_电容_CC0201KRX5R6BB224.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121721998.46 KB11页52
IC封装资料_连接器_1759020.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1284136.13 MB445页295
IC封装资料_连接器_9631S-21Z02-GFN4.pdf
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2024-12-12324204.61 KB1页296
IC封装资料_电容_GRM1555C2A120JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12726920.26 KB29页80
IC封装资料_电容_CL21A225KOFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A225KOFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-12395360.64 KB3页179
IC封装资料_电容_CC0201KRX5R6BB473.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12514998.46 KB11页70
IC封装资料_连接器_9631S-22Z02-GFN4.pdf
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2024-12-12302204.61 KB1页72
IC封装资料_连接器_9631S-23Z02-GFN4.pdf
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2024-12-1269204.61 KB1页134
IC封装资料_电容_GRM1885C1E103JA01D.pdf
GRM1885C1E103JA01_(0603,C0G:EIA,10000pF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-121189943.97 KB30页44
IC封装资料_电容_GRM1885C1E102JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121808944.07 KB30页289
IC封装资料_电容_CL21A225KPFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-122687.55 MB84页17
IC封装资料_电容_CC0201KRX7R5BB103.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1215341.22 MB13页292
IC封装资料_连接器_1828003.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12179236.13 MB445页195

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