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IC封装资料_电源管理芯片_LTM8020IV_PBF.pdf
LTM802018020feFormoreinformationwww.linear.com/LTM8020TYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION200mA,36VDC/DCµModuleRegul...
2024-12-12476481.43 KB16页7
IC封装资料_电容_GRM1885C1H1R2BA01D.pdf
GRM1885C1H1R2BA01_(0603,C0G:EIA,1.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121755944.12 KB30页190
IC封装资料_电源管理芯片_LTM8020EV_PBF.pdf
LTM802018020feFormoreinformationwww.linear.com/LTM8020TYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION200mA,36VDC/DCµModuleRegul...
2024-12-12979481.43 KB16页286
IC封装资料_电容_GRM1885C1H1R2CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121359944.07 KB30页70
IC封装资料_电容_GRM155R71C104KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121932920.26 KB29页82
IC封装资料_电容_CC0201KRX7R9BB221.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128791.22 MB13页91
IC封装资料_电容_CL10B104KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12211259.58 KB3页198
IC封装资料_电容_CC0201KRX7R8BB472.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12869998.46 KB11页174
IC封装资料_电容_CL10B104KO8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12558259.58 KB3页16
IC封装资料_电容_GRM1885C1H1R5CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121868944.07 KB30页230
IC封装资料_电容_0805CG121J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215531.05 MB27页182
IC封装资料_电容_GRM1885C1H1R5BA01D.pdf
GRM1885C1H1R5BA01_(0603,C0G:EIA,1.5pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121593944.1 KB30页155
IC封装资料_电感_YNR3010-330M.pdf
SMDPowerInductors-YNR3010Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-1250661.07 KB5页174
IC封装资料_电容_CC0201KRX7R9BB471.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12741998.46 KB11页173
IC封装资料_电源管理芯片_LTM8022EV_PBF.pdf
LTM802218022fdFEATURESAPPLICATIONSDESCRIPTION1A,36VDC/DCµModuleTheLTM®8022isacomplete1A,DC/DCstep-downpowersupply.Includedinthep...
2024-12-12278359.48 KB20页210
IC封装资料_电容_CC0201KRX7R9BB331.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12287998.46 KB11页145
IC封装资料_电容_CL10B104KO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-126321.45 MB36页147
IC封装资料_连接器_1829170.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deJan25,2011ExtractfromtheonlinecatalogGMSTBV2,5/4-GF-7,62OrderNo.:1...
2024-12-12877238.57 KB5页158
IC封装资料_连接器_1829167.pdf
https://www.phoenixcontact.com/us/produkte/182916719.10.2012Page1/6Basestrip-GMSTBV2,5/3-GF-7,62-1829167Pleasebeinformedthatthedat...
2024-12-12691195.05 KB6页114
IC封装资料_电容_0805CG122J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123051.05 MB27页6

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