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IC封装资料_电容_GJM1555C1HR60BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1248010.43 MB296页213
IC封装资料_电容_0805B103K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129401.26 MB20页52
IC封装资料_电容_0805B103K251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129641.26 MB20页246
IC封装资料_电感_SWPA5020S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-122601.32 MB22页127
IC封装资料_电容_CC1206ZKY5V7BB106.pdf
SProductSpecification–March07,2017V.8DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurpose&HighcapacitanceClass2,Y5V6.3...
2024-12-123391.08 MB13页270
IC封装资料_电源管理芯片_LTC3633EUFD_TRPBF.pdf
LTC363313633fdFormoreinformationwww.linear.com/LTC3633TYPICALAPPLICATIONFEATURESDESCRIPTIONDualChannel3A,15VMonolithicSynchronousS...
2024-12-121033489.63 KB28页4
IC封装资料_电容_0603F223M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128051.05 MB27页104
IC封装资料_电容_GRM033R60J225ME15D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
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IC封装资料_电感_SDFL1608Q2R2KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121721457.75 KB7页102
IC封装资料_电感_SDFL1608Q1R8KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-12416457.75 KB7页146
IC封装资料_连接器_1757323.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12144936.13 MB445页32
IC封装资料_电容_0805B103K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122881.05 MB27页120
IC封装资料_电感_SWPA5020S5R6MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
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IC封装资料_电源管理芯片_LTC3642EDD-3.3_TRPBF.pdf
LTC364213642fcTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONHighEfficiency,HighVoltage50mASynchronousStep-DownConverterTheLTC®...
2024-12-125491.76 MB22页228
IC封装资料_电容_0805B103K501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218001.26 MB20页70
IC封装资料_电感_SWPA5020S6R8MT.pdf
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2024-12-1219501.32 MB22页56
IC封装资料_电源管理芯片_LTC3646EMSE-1_PBF.pdf
LTC3646/LTC3646-1136461fcFormoreinformationwww.linear.com/LTC3646TYPICALAPPLICATIONFEATURESDESCRIPTION40V,1ASynchronousStep-DownCo...
2024-12-121031658.79 KB28页220
IC封装资料_电源管理芯片_LTC1326CS8-2.5_PBF.pdf
1LTC1326/LTC1326-2.5132625fcTYPICALAPPLICATIOUAPPLICATIOSUFEATURESDESCRIPTIOUMicropowerPrecisionTripleSupplyMonitorsRSTOutputVolta...
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IC封装资料_电容_CL05B472KA5NNNC.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12149817.81 MB176页7
IC封装资料_电源管理芯片_LTC1258CMS8-2.5_TRPBF.pdf
LTC1258Series11258sfbTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONMicropowerLowDropoutReferencesTheLTC®1258/LTC1258-2.5/LTC12...
2024-12-121991220.47 KB8页22

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