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IC封装资料_电源管理芯片_LTC3111EMSE_PBF.pdf
LTC311113111faFormoreinformationwww.linear.com/LTC3111LOADCURRENT(A)0.000170EFFICIENCY(%)80901000.0011100.010.13111TA01b60504030VI...
2024-12-12308585.65 KB32页15
IC封装资料_电容_0805B183K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214361.05 MB27页120
IC封装资料_电容_0603N101J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217021.26 MB20页125
IC封装资料_电容_0805B184K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217161.05 MB27页263
IC封装资料_电容_CL03A105MP3NSNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03A225MQ3CRNC·Product:Multi-layerCeramicCapacitor...
2024-12-12591.42 MB36页164
IC封装资料_电容_0603N102J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215981.26 MB20页208
IC封装资料_电感_SWPA6028S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218171.32 MB22页34
IC封装资料_电感_SWPA3012S680MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127301.32 MB22页24
IC封装资料_电容_CL10A106KQ8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12740259.57 KB3页260
IC封装资料_电源管理芯片_LTC3112EDHD_TRPBF.pdf
LTC311213112fdFormoreinformationwww.linear.com/LTC3112TYPICALAPPLICATIONDESCRIPTION15V,2.5ASynchronousBuck-BoostDC/DCConverterTheL...
2024-12-121487713.69 KB32页3
IC封装资料_电容_GRM21BR61C226ME44L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1264510.43 MB296页292
IC封装资料_电感_SWPA6028S4R7NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1217721.32 MB22页223
IC封装资料_电源管理芯片_LTC3855IUJ_TRPBF.pdf
LTC38553855fTypicalapplicaTionDescripTionDual,MultiphaseSynchronousDC/DCControllerwithDifferentialRemoteSenseTheLTC®3855isadualPo...
2024-12-1210082.16 MB44页235
IC封装资料_电容_GRM033R71H152KA12D.pdf
GRM033R71H152KA12_(0201,X7R:EIA,1500pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12210971.07 KB30页50
IC封装资料_电容_0603N120J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-121951.26 MB20页274
IC封装资料_电容_CL10A106MO8NQNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12161259.58 KB3页174
IC封装资料_电感_SWPA3015S1R0NT.pdf
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2024-12-1213871.32 MB22页117
IC封装资料_电容_CL10A106MA8NRNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121293259.58 KB3页158
IC封装资料_电源管理芯片_LTC3113EDHD_TRPBF.pdf
LTC311313113fTYPICALAPPLICATIONDESCRIPTION3ALowNoiseBuck-BoostDC/DCConverterTheLTC®3113isawideVINrange,highlyefficient,fixedfrequ...
2024-12-121641471.89 KB24页260
IC封装资料_电容_CL03A105MP3NSNH.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127067.46 MB84页114

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