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IC封装资料_电容_0603N222J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215211.26 MB20页86
IC封装资料_电感_SWPA4012S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-123611.32 MB22页65
IC封装资料_电容_GRM21BR61E475KA12L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
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IC封装资料_电感_SWPA6028S470MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127071.32 MB22页214
IC封装资料_电源管理芯片_LTC3872EDDB_TRMPBF.pdf
LTC387213872fcFormoreinformationwww.linear.com/LTC3872NoRSENSECurrentModeBoostDC/DCControllerHighEfficiency3.3VInput,5VOutputBoost...
2024-12-12620339.95 KB22页170
IC封装资料_电源管理芯片_LTC3869IUFD_TRPBF.pdf
LTC3869/LTC3869-2138692fbFormoreinformationwww.linear.com/LTC3869TypicalapplicaTionDescripTionDual,2-PhaseSynchronousStep-DownDC/D...
2024-12-12570754.69 KB44页53
IC封装资料_电容_CL03B222KP3NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03B222KP3NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210451.45 MB36页50
IC封装资料_电容_CL10A225KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121414259.58 KB3页129
IC封装资料_电容_0603N250J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-128001.26 MB20页176
IC封装资料_电容_CL10A225KA5LNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121293259.58 KB3页207
IC封装资料_电源管理芯片_LTC3130EMSE_TRPBF.pdf
LTC3130/LTC3130-113130fFormoreinformationwww.linear.com/LTC3130TYPICALAPPLICATIONFEATURESDESCRIPTION25V,600mABuck-BoostDC/DCConver...
2024-12-121784.78 MB38页189
IC封装资料_电容_0805B222K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
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IC封装资料_电容_CL03C0R3BA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-1216091.4 MB36页10
IC封装资料_电容_0603N270J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210421.26 MB20页36
IC封装资料_电感_SWPA6028S680MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
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IC封装资料_电感_SWPA4012S3R3NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
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IC封装资料_电源管理芯片_LTC3872ETS8_TRMPBF.pdf
LTC387213872fcFormoreinformationwww.linear.com/LTC3872NoRSENSECurrentModeBoostDC/DCControllerHighEfficiency3.3VInput,5VOutputBoost...
2024-12-12989339.95 KB22页277
IC封装资料_电容_GRM155R6YA224KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12383920.26 KB29页152
IC封装资料_电容_CL03C0R5BA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-121600355.35 KB3页283
IC封装资料_电容_0603N271J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217291.26 MB20页95

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