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IC封装资料_电容_VY1222M43Y5UC63V0.pdf
VY1CompactSerieswww.vishay.comVishayBCcomponentsRevision:29-Mar-181DocumentNumber:28555Fortechnicalquestions,contact:cdc@vishay.co...
2024-12-12272287.37 KB8页115
IC封装资料_电容_VJ0805Y104KXABE31.pdf
VJ....31/VJ....34AutomotiveMLCCwww.vishay.comVishayVitramonAlternativeDeviceAvailable,SeeGA....31GandGA....34GAutomotiveMLCCRevisi...
2024-12-12334300.83 KB21页4
IC封装资料_电感_LQG15HS1N5S02D.pdf
SpecNo.:JELF243B_0010T-01P1/13MURATAMFGCO.,LTDCHIPCOILS(CHIPINDUCTORS)LQG15HS□□□□02□REFERENCESPECIFICATION1.ScopeThisreferenc...
2024-12-12174454.09 KB13页278
IC封装资料_电容_ZRB15XR60J106ME12D.pdf
Lsize1.0±0.2mmWsize0.5±0.2mmTsize0.65±0.15mmExternalterminalwidthe0.1to0.4mmDistancebetweenexternalterminalsg0.3mmmin.Sizecodei...
2024-12-1216953.25 MB2页77
IC封装资料_电容_GCM31MR71H474KA37L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-122954.17 MB96页31
IC封装资料_电容_0201CG1R5B500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121791.05 MB27页245
IC封装资料_电感_LQG15HS1N8S02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-1291361.38 KB11页32
IC封装资料_电感_LQG15HS1N6S02D.pdf
SpecNo.JELF243B-0010Q-01P.1/11MURATAMFG.CO.,LTDCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.ScopeThisreference...
2024-12-12604359.54 KB11页191
IC封装资料_电容_0201CG1R5C250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215751.05 MB27页88
IC封装资料_电感_LQG15HS2N0S02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121135361.38 KB11页243
IC封装资料_电声器件_TMB12A03.pdf
TMB12A03ROHSSPECV1.0规格书SpecificationTMB12A03C96222ROHS品名ModelnamePROPRIETARYHuanengElectronicco.,Ltd.CONFIDENTIALHuanengElect...
2024-12-121038384.14 KB4页164
IC封装资料_电声器件_B4013AM-087.pdf
SpecificationofElectretCondenserMicrophone(RoHSCompliance&Halogen-Free)havesound,willtravelB4013AM-087APVDDESIGNSTANDARDCHKDGoerTe...
2024-12-121104663.34 KB16页287
IC封装资料_电容_GCM31MR72A224KA37L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-122334.17 MB96页149
IC封装资料_电容_0201CG1R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124721.05 MB27页81
IC封装资料_电感_LQG15HS2N2B02D.pdf
SpecNo.JELF243B-0010Q-01P.1/11MURATAMFG.CO.,LTDCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.ScopeThisreference...
2024-12-12764360.21 KB11页56
IC封装资料_电声器件_TMB12A12.pdf
TMB12A12ROHSSPECV1.0规格书SpecificationTMB12A12C96079ROHS品名ModelnamePROPRIETARYHuanengElectronicco.,Ltd.CONFIDENTIALHuanengElect...
2024-12-121577383.33 KB4页7
IC封装资料_电容_CC0402KRX7R9BB472.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12197017.81 MB176页284
IC封装资料_电容_0201CG1R8B500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128381.05 MB27页160
IC封装资料_电感_LQG15HS2N4S02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12629361.38 KB11页242
IC封装资料_电感_LQG15HS2N2S02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12573361.38 KB11页216

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