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IC封装资料_电感_SWPA4020S1R5NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213141.32 MB22页88
IC封装资料_电源管理芯片_LTC4002ES8-4.2_PBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-121695253.54 KB16页193
IC封装资料_连接器_1757527.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/8-GOrderNo.:1757527Thefiguresh...
2024-12-121347229.53 KB5页69
IC封装资料_连接器_1757514.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/6-GOrderNo.:1757514Thefiguresh...
2024-12-121629229.22 KB5页253
IC封装资料_电容_CL10A226KQ8NRNE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121216259.58 KB3页241
IC封装资料_电容_0402N470G500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1213171.26 MB20页50
IC封装资料_电容_CL10A225MQ8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225MQ8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121179360.84 KB3页255
IC封装资料_电容_0805B272K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210121.26 MB20页202
IC封装资料_电感_NLCV32T-221K-EF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12660249.79 KB16页81
IC封装资料_电感_SWPA6045S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129831.32 MB22页130
IC封装资料_连接器_1753534.pdf
https://www.phoenixcontact.com/us/produkte/175353403.10.2012Page1/7Basestrip-MSTBV2,5/7-G-1753534Pleasebeinformedthatthedatashowni...
2024-12-121973203.46 KB7页284
IC封装资料_电源管理芯片_LTC4002ES8-4.2_TRPBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-12323253.54 KB16页276
IC封装资料_电容_GRM155R60J225KE01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1289610.43 MB296页11
IC封装资料_电容_C0603C101J3GACTU.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comC1003_C0G•6/7/20181Oneworld.OneKEMETBe...
2024-12-12981.41 MB20页27
IC封装资料_电源管理芯片_XL6007.pdf
XL6007400KHz60V2ASwitchingCurrentBoost/Buck-Boost/InvertingDC/DCConverterRev1.2www.xlsemi.com1Features�Wide3.6Vto24VInputVoltageR...
2024-12-12204259.93 KB8页242
IC封装资料_电源管理芯片_XL6006S.pdf
Datasheet180KHz60V5ASwitchingCurrentBoostLEDConstantCurrentDriverXL6006Rev1.6www.xlsemi.com1Features�Wide5Vto32VInputVoltageRange...
2024-12-12737387.66 KB11页124
IC封装资料_电源管理芯片_XL6005.pdf
Datasheet180KHz60V4ASwitchingCurrentBoostLEDConstantCurrentDriverXL6005Rev1.6www.xlsemi.com1Features�Wide3.6Vto32VInputVoltageRan...
2024-12-12803503.19 KB11页121
IC封装资料_电容_CL10A226MO7JZNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A226MO7JZNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217771.48 MB36页240
IC封装资料_电容_GRM1555C1H8R0DA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12432920.26 KB29页101
IC封装资料_电容_GRM1555C1H8R0CA01D.pdf
GRM1555C1H8R0CA01_(0402,C0G:EIA,8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121948944.28 KB30页33

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