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IC封装资料_电源管理芯片_ZMR500FTA.pdf
ZMRSeriesDocumentnumber:DS32195Rev.11-21of7www.diodes.comMarch2013©DiodesIncorporatedZMRSeriesFIXED2.5,3.3AND5VOLTMINIATUREVOLTAG...
2024-12-12921277.06 KB7页95
IC封装资料_电容_0805B332K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129951.26 MB20页228
IC封装资料_电容_GRM1555C1H100GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12235920.26 KB29页63
IC封装资料_电容_CL10C331JB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12619259.57 KB3页104
IC封装资料_电感_SWPA8040S2R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1210311.32 MB22页245
IC封装资料_电容_CL10C331JB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121549316.28 KB3页150
IC封装资料_电容_CL10C331JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12912316.28 KB3页180
IC封装资料_电源管理芯片_LTC4054LES5-4.2_TRPBF.pdf
LTC4054L-4.214054l42faTypicalapplicaTionFeaTuresDescripTion150mAStandaloneLinearLi-IonBatteryChargerinThinSOTTheLTC®4054Lisacompl...
2024-12-121723299.22 KB16页156
IC封装资料_电源管理芯片_LTC4054ES5-4.2_TRPBF.pdf
1LTC4054-4.2/LTC4054X-4.2405442xfFEATURESDESCRIPTIOUAPPLICATIOSUTYPICALAPPLICATIOUStandaloneLinearLi-IonBatteryChargerwithThermalR...
2024-12-12246275.88 KB16页112
IC封装资料_电容_C0603NP0101JGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-125481.92 MB48页85
IC封装资料_电容_GRM155R60J474KE19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121860920.26 KB29页262
IC封装资料_连接器_1803507.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1234736.13 MB445页58
IC封装资料_电容_CL10A226MR8NQNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12725259.58 KB3页124
IC封装资料_电容_CL10A226MR8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12715259.58 KB3页49
IC封装资料_电容_0805B332K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213721.05 MB27页287
IC封装资料_电感_SWPA8040S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129101.32 MB22页180
IC封装资料_电源管理芯片_LTC4060EFE_TRPBF.pdf
1LTC40604060fStandaloneLinearNiMH/NiCdFastBatteryCharger■CompleteFastChargerControllerforSingle,2-,3-or4-SeriesCellNiMH/NiCdBatte...
2024-12-121950276.65 KB20页50
IC封装资料_电容_GRM155R60J475ME47D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12250920.26 KB29页28
IC封装资料_电容_CL10A226MR8NQNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A226MR8NQNE·Product:Multi-layerCeramicCapacitor...
2024-12-1218861.48 MB36页99
IC封装资料_电容_0805B333K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210371.26 MB20页87

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