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IC封装资料_电容_CL10C821JB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12172259.58 KB3页145
IC封装资料_电感_VLS252010HBX-2R2M-1.pdf
INDUCTORSApril2016��VLS252010HBX-1��VLS252010HBX-1�VLS-HBX-1��更多资料下载请到五八文库wk.58sms.com(...
2024-12-121312309.07 KB9页68
IC封装资料_电源管理芯片_LTC4412HVIS6_TRMPBF.pdf
1LTC4412HVsn4412hv4412hvfsAPPLICATIOSUFEATURESDESCRIPTIOUTYPICALAPPLICATIOU36V,LowLossPowerPathTMControllerinThinSOTIVeryLowLossRe...
2024-12-121809260.58 KB12页198
IC封装资料_电容_C1808V104KBRACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1034_X7R_HV_ARC_SMD•11/9/2018FortLauderdale,FL33301USA•954-7...
2024-12-126141.57 MB23页233
IC封装资料_电容_CL10B103KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12290361.48 KB3页230
IC封装资料_机械式继电器_G6K-2G-Y.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-1217401.72 MB9页75
IC封装资料_机械式继电器_G6K-2G.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-126651.72 MB9页230
IC封装资料_电容_0805B682K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127351.26 MB20页207
IC封装资料_电感_WPN3012H2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121979624.92 KB9页236
IC封装资料_电容_GRM1555C1H390JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121184920.26 KB29页269
IC封装资料_电感_VLS252012T-2R2M1R3.pdf
(1/2)002-02/20080822/e531_vls252012.fm•Allspecificationsaresubjecttochangewithoutnotice.SMDInductors(Coils)ForPowerLine(Wound,Mag...
2024-12-121750130.34 KB2页90
IC封装资料_电容_GRM1555C1H390GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12309920.26 KB29页205
IC封装资料_电容_CL10CR47BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12529259.58 KB3页76
IC封装资料_电源管理芯片_LTC4412IS6_TRPBF.pdf
LTC441214412fbFormoreinformationwww.linear.com/LTC4412TypicalapplicaTionDescripTionLowLossPowerPath™ControllerinThinSOTTheLTC®44...
2024-12-121650486.18 KB14页138
IC封装资料_电容_CL10C910JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-1274259.58 KB3页207
IC封装资料_电容_C2012X5R1C106KT0J0E.pdf
COM-GEN-006DELIVERYSPECIFICATIONSPEC.No.C-General-fDATE:Aug,2019ToUpontheacceptanceofthisspec.previousspec.(C2011-0454)shallbeabol...
2024-12-1211571.79 MB37页277
IC封装资料_电源管理芯片_LTC4412HVIS6_TRPBF.pdf
1LTC4412HVsn4412hv4412hvfsAPPLICATIOSUFEATURESDESCRIPTIOUTYPICALAPPLICATIOU36V,LowLossPowerPathTMControllerinThinSOTIVeryLowLossRe...
2024-12-12132260.58 KB12页199
IC封装资料_电容_GRM155R61C225ME44D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12568920.26 KB29页233
IC封装资料_机械式继电器_G6K-2P.pdf
1G6KG6KSurfaceMountingRelaySurfaceMountingRelaywiththeWorld’sSmallestMountingArea•Subminiaturemodelassmallas5.2(H)×6.5(W)×10(L...
2024-12-1215391.72 MB9页77
IC封装资料_电容_CL10B103KA8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-1214515.82 MB36页206

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