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IC封装资料_电容_CL10F224ZA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-129451.42 MB36页35
IC封装资料_电感_WPN201610H1R0MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12485624.92 KB9页56
IC封装资料_电容_C3225X5R0J107M250AC.pdf
SeriesNameCaseSizeCodeTemperatureCharacteristicsRatedVoltageCodeCapacitanceToleranceThicknessCodePackagingCodeSpecialCodeDescripti...
2024-12-1273463.62 KB3页22
IC封装资料_电感_WPN4020H100MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121931624.92 KB9页83
IC封装资料_电容_GRM1555C1H560GA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12173810.43 MB296页8
IC封装资料_电源管理芯片_LTC4417CUF_TRPBF.pdf
LTC441714417fTypicalapplicaTionFeaTuresDescripTionPrioritizedPowerPath™ControllerTheLTC®4417connectsoneofthreevalidpowersupplies...
2024-12-12646515.8 KB32页74
IC封装资料_电容_0805CG1R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125791.05 MB27页258
IC封装资料_电感_WPN201610H1R5MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12909624.92 KB9页252
IC封装资料_接口及驱动芯片_SN74LVC2T45DCU.pdf
B1DIR57A12VCCAVCCBB26A23ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisdatas...
2024-12-122711.19 MB31页85
IC封装资料_电源管理芯片_LTC4417IUF_PBF.pdf
LTC441714417fTypicalapplicaTionFeaTuresDescripTionPrioritizedPowerPath™ControllerTheLTC®4417connectsoneofthreevalidpowersupplies...
2024-12-121899515.8 KB32页222
IC封装资料_电容_C3225X5R1E106KTJ00E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-129781.61 MB56页239
IC封装资料_接口及驱动芯片_SN74LVC16T245DGGR.pdf
ToSevenOtherChannels1DIR1A11B11OEToSevenOtherChannels2DIR2A12B12OE14724364822513ProductFolderSample&BuyTechnicalDocumentsTools&Sof...
2024-12-1216301.28 MB34页251
IC封装资料_电感_WPN201610H2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121050624.92 KB9页46
IC封装资料_电容_CL10F225ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121103259.58 KB3页69
IC封装资料_电容_GRM155R61E225KE11D.pdf
GRM155R61E225KE11_(0402,X5R:EIA,2.2uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12910923.09 KB29页74
IC封装资料_电容_CL10F224ZO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121457360.68 KB3页141
IC封装资料_电容_0805CG1R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121011.05 MB27页261
IC封装资料_电容_CL10F224ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12876259.58 KB3页191
IC封装资料_电容_C3225X7R1C106KT000N.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-126031.61 MB56页188
IC封装资料_晶体管_BSS138LT1G.pdf
©SemiconductorComponentsIndustries,LLC,2016March,2019−Rev.121PublicationOrderNumber:BSS138LT1/DBSS138L,BVSS138LPowerMOSFET200mA,...
2024-12-12545194.23 KB6页68

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