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IC封装资料_电容_CC0201KRX7R9BB221.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128801.22 MB13页91
IC封装资料_电容_CL10B104KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12212259.58 KB3页198
IC封装资料_电容_CC0201KRX7R8BB472.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12870998.46 KB11页174
IC封装资料_电容_CL10B104KO8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12559259.58 KB3页16
IC封装资料_电容_GRM1885C1H1R5CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121868944.07 KB30页230
IC封装资料_电容_0805CG121J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215541.05 MB27页182
IC封装资料_电容_GRM1885C1H1R5BA01D.pdf
GRM1885C1H1R5BA01_(0603,C0G:EIA,1.5pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121594944.1 KB30页155
IC封装资料_电感_YNR3010-330M.pdf
SMDPowerInductors-YNR3010Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-1250661.07 KB5页174
IC封装资料_电容_CC0201KRX7R9BB471.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12742998.46 KB11页173
IC封装资料_电容_CC0201KRX7R9BB331.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12288998.46 KB11页145
IC封装资料_电源管理芯片_LTM8022EV_PBF.pdf
LTM802218022fdFEATURESAPPLICATIONSDESCRIPTION1A,36VDC/DCµModuleTheLTM®8022isacomplete1A,DC/DCstep-downpowersupply.Includedinthep...
2024-12-12279359.48 KB20页210
IC封装资料_连接器_1829170.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deJan25,2011ExtractfromtheonlinecatalogGMSTBV2,5/4-GF-7,62OrderNo.:1...
2024-12-12877238.57 KB5页158
IC封装资料_电容_CL10B104KO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-126321.45 MB36页147
IC封装资料_连接器_1829167.pdf
https://www.phoenixcontact.com/us/produkte/182916719.10.2012Page1/6Basestrip-GMSTBV2,5/3-GF-7,62-1829167Pleasebeinformedthatthedat...
2024-12-12691195.05 KB6页114
IC封装资料_连接器_1829154.pdf
https://www.phoenixcontact.com/us/produkte/182915418.10.2012Page1/6Basestrip-GMSTBV2,5/2-GF-7,62-1829154Pleasebeinformedthatthedat...
2024-12-121894183.06 KB6页156
IC封装资料_电容_0805CG122J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123061.05 MB27页6
IC封装资料_电感_YNR3015-1R0M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121778665.41 KB5页24
IC封装资料_电容_GRM1885C1H1R8BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121787944.07 KB30页243
IC封装资料_电感_YNR3010-470M.pdf
SMDPowerInductors-YNR3010Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121524661.07 KB5页210
IC封装资料_电容_CC0201MRX5R5BB104.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-12671.22 MB13页145

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