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IC封装资料_电容_CC0402BRNPO9BNR68.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12660998.46 KB11页76
IC封装资料_电容_CL10B105KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12161259.58 KB3页87
IC封装资料_电容_CC0402BRNPO9BNR80.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121894998.46 KB11页266
IC封装资料_电容_CL10B105KA8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12272259.58 KB3页21
IC封装资料_电容_GRM1885C1H3R0CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12152944.07 KB30页223
IC封装资料_电容_0805CG200J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213861.05 MB27页145
IC封装资料_电容_GRM1885C1H3R0BA01D.pdf
GRM1885C1H3R0BA01_(0603,C0G:EIA,3pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12844944.09 KB30页203
IC封装资料_电容_CL21A226MQCLRNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A226MQCLRNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218301.48 MB36页176
IC封装资料_电感_YNR3015-151M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121331665.41 KB5页61
IC封装资料_连接器_1759033.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12175336.13 MB445页286
IC封装资料_电容_CL21A226MPQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1219191.42 MB36页188
IC封装资料_连接器_1830606.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12123536.13 MB445页265
IC封装资料_电容_GRM1885C1H3R3BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12939944.07 KB30页219
IC封装资料_电容_GRM155R71C223KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121715920.26 KB29页300
IC封装资料_电容_CL21A226MQQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1213301.42 MB36页159
IC封装资料_电容_CL10B105KA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-129921.45 MB36页242
IC封装资料_电容_GRM1885C1H3R6BA01D.pdf
GRM1885C1H3R6BA01_(0603,C0G:EIA,3.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12959944.1 KB30页126
IC封装资料_电感_YNR3015-220M.pdf
SMDPowerInductors-YNR3015Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121796665.41 KB5页30
IC封装资料_电容_GRM1885C1H3R3CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-1296944.07 KB30页25
IC封装资料_电容_CL21A226MQQNNNF.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1213117.55 MB84页34

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