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IC封装资料_电容_CC0402CRNPO9BN3R9.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219341.22 MB13页260
IC封装资料_电感_YNR4030-331M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121410664.95 KB5页106
IC封装资料_电感_YNR4030-330M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121322664.95 KB5页241
IC封装资料_电容_CL21B272KBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1219197.46 MB84页28
IC封装资料_电感_YNR4030-221M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12278664.95 KB5页300
IC封装资料_电容_CC0402CRNPO9BN4R3.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1215571.22 MB13页26
IC封装资料_电容_GRM155R71E153KA61D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12748920.26 KB29页269
IC封装资料_电容_GRM1885C1H100GA01D.pdf
GRM1885C1H100GA01_(0603,C0G:EIA,10pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12534944.1 KB30页24
IC封装资料_电容_CL10B123KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B123KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12142361.45 KB3页225
IC封装资料_电容_GRM1885C1H100FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121342944.07 KB30页271
IC封装资料_电容_CL21B331KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219741.45 MB36页125
IC封装资料_电容_0805CG471J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219241.05 MB27页112
IC封装资料_连接器_1830693.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12151836.13 MB445页237
IC封装资料_电感_YNR4030-471M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12789664.95 KB5页168
IC封装资料_电感_YNR4030-470M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12367664.95 KB5页117
IC封装资料_电源管理芯片_MC34063ADR2G.pdf
©SemiconductorComponentsIndustries,LLC,2016December,2016−Rev.241PublicationOrderNumber:MC34063A/DMC34063A,MC33063A,SC34063A,SC33...
2024-12-124181.19 MB15页299
IC封装资料_电容_GRM155R71E183KA61D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121648920.26 KB29页118
IC封装资料_电容_CL10B123KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B123KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121318361.46 KB3页89
IC封装资料_电容_CL10B123KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B123KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121376361.46 KB3页229
IC封装资料_电容_0805CG500J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128641.05 MB27页273

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