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IC封装资料_电容_CL21B472KCANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1216337.46 MB84页233
IC封装资料_电源管理芯片_MCP1825S-3302E_DB.pdf
©2008MicrochipTechnologyInc.DS22056B-page1MCP1825/MCP1825SFeatures•500mAOutputCurrentCapability•InputOperatingVoltageRange:2.1V...
2024-12-121850733.69 KB38页63
IC封装资料_电容_CC0402CRNPO9BN6R8.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212901.22 MB13页115
IC封装资料_电容_CL10B152KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12631452.9 KB21页81
IC封装资料_电容_GRM1885C1H103JA01D.pdf
GRM1885C1H103JA01_(0603,C0G:EIA,10000pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-12798944.09 KB30页43
IC封装资料_电容_CL10B152KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12375259.58 KB3页300
IC封装资料_电容_CL21B473KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1216571.45 MB36页218
IC封装资料_电容_0805CG680J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213251.05 MB27页188
IC封装资料_电容_CL21B473KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B473KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218391.45 MB36页143
IC封装资料_电容_CC0402CRNPO9BN8R0.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212771.22 MB13页3
IC封装资料_电容_0805CG620J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123461.05 MB27页284
IC封装资料_电容_GRM1885C1H111JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12513944.07 KB30页154
IC封装资料_电感_YNR5020-6R8M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12903664.7 KB5页258
IC封装资料_电容_GRM1885C1H110JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121540944.07 KB30页157
IC封装资料_电容_CL21B473KCFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-125767.46 MB84页65
IC封装资料_电感_YNR5020-4R7M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12194664.7 KB5页48
IC封装资料_电感_YNR5020-3R3M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121359664.7 KB5页280
IC封装资料_电源管理芯片_MCP73811T-420I_OT.pdf
©2007MicrochipTechnologyInc.DS22036B-page1MCP73811/2Features•CompleteLinearChargeManagementController-IntegratedPassTransistor-I...
2024-12-121756747.73 KB22页284
IC封装资料_电容_CC0402CRNPO9BNR75.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12499998.46 KB11页83
IC封装资料_电容_CC0402CRNPO9BN9R0.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-12851.22 MB13页177

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