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IC封装资料_电容_CC0402GRNPO8BN150.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12357998.46 KB11页117
IC封装资料_电容_CC0402FRNPO9BN680.pdf
ProductSpecification–March7,2017V.16DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurposeClass1,NP016VTO50V0.22pFto100n...
2024-12-121293747.56 KB15页43
IC封装资料_电源管理芯片_MCP73871-2CCI_ML.pdf
2008-2019MicrochipTechnologyInc.DS20002090E-page1MCP73871Features•IntegratedSystemLoadSharingandBatteryChargeManagement-Simulta...
2024-12-1215703.29 MB40页212
IC封装资料_电容_GRM1885C1H131GA01D.pdf
GRM1885C1H131GA01_(0603,C0G:EIA,130pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-1267944.09 KB30页81
IC封装资料_电容_CC0402GRNPO9BN100.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-122111.22 MB13页75
IC封装资料_电容_GRM155R71E473KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12249920.26 KB29页206
IC封装资料_电容_GRM1885C1H131JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121085944.07 KB30页149
IC封装资料_电容_CL10B153KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12168452.9 KB21页99
IC封装资料_电容_CL21B684KOFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1215987.46 MB84页14
IC封装资料_电容_CL10B153KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B153KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12810361.14 KB3页83
IC封装资料_电容_0805F104M101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212691.05 MB27页122
IC封装资料_电容_GRM1885C1H132JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121963944.07 KB30页166
IC封装资料_电容_CL21B821KBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B821KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12551360.67 KB3页38
IC封装资料_电感_YNR5020-470M.pdf
SMDPowerInductors-YNR5020Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12540664.7 KB5页300
IC封装资料_电容_CC0402GRNPO9BN101.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210861.22 MB13页142
IC封装资料_电容_GRM155R71E562KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121730920.26 KB29页89
IC封装资料_电容_GRM1885C1H150FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121859944.07 KB30页5
IC封装资料_电容_CL21B822KBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-124667.46 MB84页53
IC封装资料_电容_CL10B153KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121740259.58 KB3页199
IC封装资料_电容_CL10B153KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121643259.58 KB3页162

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