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IC封装资料_电感_YP0705-331M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121436721.48 KB5页3
IC封装资料_电容_ERJ1HM560F09OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12197315.39 MB230页92
IC封装资料_电源管理芯片_SP6201EM5-L-3-3_TR.pdf
SSPP66220000//SSPP66220011110000mmAA//220000mmAAMMiiccrrooppoowweerrCCMMOOSSLLDDOORReegguullaattoorrssMay2012Rev.2.1.0ExarCorporat...
2024-12-127151 MB17页226
IC封装资料_电容_GRM188R71A124KA01D.pdf
GRM188R71A124KA01_(0603,X7R:EIA,0.12uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121421962.4 KB30页93
IC封装资料_电容_CL10B473KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B473KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12335361.69 KB3页135
IC封装资料_连接器_BM28B0.6-50DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121720562.52 KB8页173
IC封装资料_电容_CL10B473KA8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12930259.58 KB3页90
IC封装资料_电容_1206B471K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210601.05 MB27页227
IC封装资料_连接器_BM28B0.6-50DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121536562.52 KB8页145
IC封装资料_连接器_BM28B0.6-50DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121315562.52 KB8页159
IC封装资料_连接器_BM28B0.6-44DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12998562.52 KB8页280
IC封装资料_电感_YP0705-680M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12750721.48 KB5页209
IC封装资料_电容_RVT1E331M0810-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-126951.08 MB3页213
IC封装资料_电容_RVT1E330M0505-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-129491.08 MB3页229
IC封装资料_电感_YP0705-471M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12673721.48 KB5页53
IC封装资料_连接器_BM28B0.6-58DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121218562.52 KB8页276
IC封装资料_电源管理芯片_SPX1117M3-L_TR.pdf
SSPPXX11111177880000mmAALLoowwDDrrooppoouuttVVoollttaaggeeRReegguullaattoorrSeptember2018Rev.2.1.11/11Rev.2.1.1GENERALDESCRIPTIONT...
2024-12-12898880.19 KB11页278
IC封装资料_连接器_BM28B0.6-58DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121908562.52 KB8页241
IC封装资料_电源管理芯片_SP6641BEK-L-5-0_TR.pdf
1Rev.5/26/05,*PatentPendingSP6641A/6641B500mAAlkalineDC/DCBoostRegulatorinSOT-23©Copyright2002SipexCorporationDESCRIPTIONTheSP664...
2024-12-121855220.98 KB13页88
IC封装资料_连接器_BM28B0.6-58DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12968562.52 KB8页211

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