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IC封装资料_连接器_1725669.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12169036.13 MB445页6
IC封装资料_电源管理芯片_AP3032KTR-G1.pdf
DataSheetWHITELEDSTEP-UPCONVERTERAP3032Dec.2012Rev.1.2BCDSemiconductorManufacturingLimited1GeneralDescriptionTheAP3032isaninductor...
2024-12-121125565.41 KB13页48
IC封装资料_电容_0201CG330J250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213031.05 MB27页131
IC封装资料_电感_LQP03TN47NH02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121079281.03 KB12页239
IC封装资料_电源管理芯片_AP3103AKTR-G1.pdf
AP3103ADocumentnumber:DS37491Rev.2-21of12www.diodes.comSeptember2014©DiodesIncorporatedAP3103AAProductLineofDiodesIncorporatedCOS...
2024-12-121265487.82 KB12页257
IC封装资料_电容_GCM188L81H104KA57D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1218954.17 MB96页255
IC封装资料_电容_CC0603JRNPO9BN100.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12192917.81 MB176页242
IC封装资料_电容_0201CG360J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215231.05 MB27页263
IC封装资料_电容_0201CG330J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121021.05 MB27页277
IC封装资料_电感_LQP03TN51NH02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12360281.03 KB12页95
IC封装资料_电感_LQP03TN47NJ02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12733281.03 KB12页12
IC封装资料_电源管理芯片_AP3410KTR-G1.pdf
PreliminaryDatasheet1.5MHzSynchronousStep-downDC-DCConverterAP3410Mar.2013Rev.1.1BCDSemiconductorManufacturingLimited1GeneralDescr...
2024-12-12982860.08 KB11页31
IC封装资料_电容_0201CG390J250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126531.05 MB27页252
IC封装资料_电感_LQP03TN56NJ02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121537281.03 KB12页246
IC封装资料_电源管理芯片_AP3502EMTR-G1.pdf
AP3502E340KHZ2ASYNCHRONOUSDC-DCBUCKCONVERTERDescriptionTheAP3502Eisa340kHzfixedfrequency,currentmode,PWMsynchronousbuck(step-down)...
2024-12-1213111.03 MB11页47
IC封装资料_电容_0201CG390J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210781.05 MB27页219
IC封装资料_电感_LQP03TN82NJ02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121709281.03 KB12页275
IC封装资料_电源管理芯片_AP5100WG-7.pdf
AP51001.2ASTEP-DOWNCONVERTERwith1.4MHzSWITCHINGFREQUENCYAP5100Documentnumber:DS32130Rev.3-21of12www.diodes.comApril2012©DiodesInc...
2024-12-121040490.08 KB12页234
IC封装资料_电容_GCM188R70J225KE22D.pdf
GCM188R70J225KE22_(0603,X7R:EIA,2.2uF,DC6.3V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121570936.42 KB29页156
IC封装资料_电感_LQP03TNR13J02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121045281.04 KB12页150

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