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IC封装资料_电容_GCJ21BR71H104KA01L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1218775.94 MB73页21
IC封装资料_电源管理芯片_TLC5973DR.pdf
GNDVCCControllerOUT0SDOSDIVCCGNDIREFOUT1OUT2DeviceOUT0SDOSDIVCCGNDIREFOUT1OUT2DeviceRIREFRIREFPowerSupply(5V)ProductFolderOrderNow...
2024-12-123351.38 MB37页24
IC封装资料_电容_GRM188R71H104MA93D.pdf
GRM188R71H104MA93_(0603,X7R:EIA,0.1uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121293962.36 KB30页151
IC封装资料_连接器_FH28-60S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-121877492.73 KB12页260
IC封装资料_连接器_FH28-45S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-121045492.73 KB12页211
IC封装资料_连接器_FH28-40S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-12569492.73 KB12页130
IC封装资料_电容_CL10B683KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B683KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12379360.67 KB3页79
IC封装资料_电容_1206CG150J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128191.05 MB27页9
IC封装资料_连接器_FH28-15S-0_5SH.pdf
■Features1.HighlyreliableconnectionandrobuststructureMulti-polarizedconnectors,reinforcedbodystructureandhighFPCretentionproduced...
2024-12-12137492.73 KB12页92
IC封装资料_电容_T491A475K025AT.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardT2005_T491•8/20/2018FortLauderdale,FL33301USA•954-766-2800•w...
2024-12-125121.47 MB23页84
IC封装资料_电感_YPRH1204-102M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-12774735.47 KB5页187
IC封装资料_电容_GCJ21BR71H105KA01L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-121054.17 MB96页126
IC封装资料_电源管理芯片_TLV431ACDBZR.pdf
VREFInputVIOKProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisdatasheetaddress...
2024-12-1216392.15 MB54页69
IC封装资料_连接器_FP243A012.pdf
客戶承認CustomerApprovalDateofIssueAPPROVEDCHECKEDR&DQAPREPAREDJOHNSONJOHNSONZHANGHAOJW_ZHOWZHANGHAO內部簽核(Signature)樣品承認書A...
2024-12-123434.62 MB14页138
IC封装资料_电容_GRM188R71H122KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12705944.07 KB30页153
IC封装资料_电容_T491A475M025AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1219961.54 MB23页300
IC封装资料_电容_CL10B683KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121022259.58 KB3页44
IC封装资料_电容_CL10B683KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B683KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12736378.87 KB3页296
IC封装资料_连接器_HB9500-95-4P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12731.21 MB1页49
IC封装资料_连接器_FPC0.5-40P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12850893.57 KB1页166

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