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IC封装资料_电容_GCM155R71H471KA37D.pdf
Lsize1.0±0.05mmWsize0.5±0.05mmTsize0.5±0.05mmExternalterminalwidthe0.15to0.35mmDistancebetweenexternalterminalsg0.3mmmin.Sizeco...
2024-12-1216113.22 MB2页36
IC封装资料_电容_CC0603JRNPO0BN102.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219711.22 MB13页176
IC封装资料_电容_0201CG180J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219791.05 MB27页242
IC封装资料_电感_LQP03TN4N3H02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121759281.03 KB12页203
IC封装资料_连接器_1725656.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1284136.13 MB445页38
IC封装资料_电源管理芯片_AP2120N-3.3TRG1.pdf
AP2120Documentnumber:DS41206Rev.4-21of25www.diodes.comJune2019©DiodesIncorporatedAP2120HIGHSPEED,EXTREMELYLOWNOISELDOREGULATORDes...
2024-12-121306805.16 KB25页152
IC封装资料_电容_CC0603JRNPO0BN121.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12866998.46 KB11页294
IC封装资料_电感_LQP03TN5N6H02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12619281.03 KB12页132
IC封装资料_电感_LQP03TN4N7H02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121940281.03 KB12页77
IC封装资料_电源管理芯片_AP2127K-ADJTRG1.pdf
AP2127Documentnumber:DS36478Rev.7-21of24www.diodes.comDecember2017©DiodesIncorporatedAP2127300mAHIGHSPEED,EXTREMELYLOWNOISECMOSLD...
2024-12-1217291010.23 KB24页67
IC封装资料_电容_GCM155R71H472KA37D.pdf
GCM155R71H472KA37_(0402,X7R:EIA,4700pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121720948.82 KB29页28
IC封装资料_电容_CC0603JRNPO0BN331.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214011.22 MB13页62
IC封装资料_电容_CC0603JRNPO0BN221.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121179998.46 KB11页90
IC封装资料_电容_0201CG200J250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216851.05 MB27页35
IC封装资料_电容_0201CG180K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215231.05 MB27页218
IC封装资料_电感_LQP03TN5N6J02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12946281.03 KB12页212
IC封装资料_电源管理芯片_AP2127N-2.8TRG1.pdf
AP2127Documentnumber:DS36478Rev.7-21of24www.diodes.comDecember2017©DiodesIncorporatedAP2127300mAHIGHSPEED,EXTREMELYLOWNOISECMOSLD...
2024-12-128481010.23 KB24页146
IC封装资料_电容_GCM155R71H473KE02D.pdf
GCM155R71H473KE02_(0402,X7R:EIA,47000pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit...
2024-12-121383934.88 KB29页98
IC封装资料_电容_CC0603JRNPO0BN470.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121955998.46 KB11页41
IC封装资料_电容_0201CG200J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217111.05 MB27页227

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