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IC资料

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IC封装资料_电容_GRM1555C1H150GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1271920.26 KB29页180
IC封装资料_电容_CL10C471JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1217091.39 MB36页95
IC封装资料_电容_0805B471K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214731.26 MB20页266
IC封装资料_电容_CL10C471JB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121628259.57 KB3页149
IC封装资料_电感_SWPA8040S680MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212371.32 MB22页32
IC封装资料_电容_C823A102J30C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-125152.9 MB5页33
IC封装资料_电容_GRM155R61A184KE19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121277920.26 KB29页210
IC封装资料_电容_GRM1555C1H150JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12162920.26 KB29页206
IC封装资料_电容_CL10C471JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121448259.58 KB3页193
IC封装资料_电容_CL10A475MO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121922259.57 KB3页166
IC封装资料_电容_C823A103J60C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-128432.9 MB5页7
IC封装资料_电感_SWPA8040S681MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1217981.32 MB22页241
IC封装资料_连接器_1804865.pdf
https://www.phoenixcontact.com/pi/products/180488104/09/2019Page1/4Printed-circuitboardconnector-PC4/11-G-7,62-1804881Pleasebeinfo...
2024-12-12694218.86 KB4页41
IC封装资料_电源管理芯片_LTC4218IGN_PBF.pdf
LTC421814218fhFormoreinformationwww.linear.com/LTC4218FeaturesapplicationsDescriptionHotSwapControllerTheLTC®4218isaHotSwapcontro...
2024-12-121619397.35 KB18页102
IC封装资料_连接器_1804852.pdf
https://www.phoenixcontact.com/us/produkte/180485219.10.2012Page1/7Basestrip-PC4/8-G-7,62-1804852Pleasebeinformedthatthedatashowni...
2024-12-121863210.37 KB7页280
IC封装资料_电阻_MFR-25FTE52-1K.pdf
Through-holeresisTorsFeATuresPowerRating1/6W,1/4W,1/2W,1W,2W,3WResistanceTolerance±0.5%,±1%,±5%T.C.R.±15ppm/°C,±25ppm/°C,±...
2024-12-121711238.34 KB3页279
IC封装资料_电源管理芯片_LTC4217CDHC_TRPBF.pdf
LTC421714217fgFormoreinformationwww.linear.com/LTC4217TypicalapplicaTionFeaTuresapplicaTionsDescripTion2AIntegratedHotSwapControll...
2024-12-121588351.49 KB20页66
IC封装资料_电阻_MFR0W4F3300A50.pdf
PartNo.料号Type类型PowerRating功率70°CDimension(尺寸)(mm)DLd±0.05H±3NormalSize(正常尺寸)MFR0W8MF-121/8W1.9±0.33.3±0.30.4528MF...
2024-12-12414473.76 KB2页264
IC封装资料_电容_GRM155R61A224KE19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12503920.26 KB29页259
IC封装资料_电容_CL10C471JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12743316.29 KB3页249

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