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IC资料

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IC封装资料_电容_GRM1555C1H151GA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1296110.43 MB296页117
IC封装资料_电源管理芯片_LTC4219IDHC-12_PBF.pdf
LTC421914219fdFormoreinformationwww.linear.com/LTC4219TypicalapplicaTionFeaTuresapplicaTionsDescripTion5AIntegratedHotSwapControll...
2024-12-12826356.63 KB18页242
IC封装资料_电源管理芯片_LTC4219CDHC-12_PBF.pdf
LTC421914219fdFormoreinformationwww.linear.com/LTC4219TypicalapplicaTionFeaTuresapplicaTionsDescripTion5AIntegratedHotSwapControll...
2024-12-12304356.63 KB18页224
IC封装资料_电容_GRM155R61A225KE95D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121538920.26 KB29页230
IC封装资料_电容_CL10C471JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121364259.58 KB3页85
IC封装资料_电容_CL10C471JB81PNL.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12261259.58 KB3页98
IC封装资料_电容_CL10A476MQENRBE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A476MQENRBE·Product:Multi-layerCeramicCapacitor...
2024-12-124981.45 MB36页268
IC封装资料_连接器_1806245.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan25,2011ExtractfromtheonlinecatalogGMSTB2,5/4-GF-7,62OrderNo.:1806245Thefi...
2024-12-12416230.05 KB5页196
IC封装资料_电容_CL10A475MQ8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12190259.58 KB3页178
IC封装资料_连接器_1806232.pdf
https://www.phoenixcontact.com/us/produkte/180623218.10.2012Page1/6Basestrip-GMSTB2,5/3-GF-7,62-1806232Pleasebeinformedthatthedata...
2024-12-12776186.35 KB6页148
IC封装资料_电阻_RC0603FR-0710KL.pdf
DATASHEETGENERALPURPOSECHIPRESISTORSRC_Lseries±0.1%,±0.5%,±1%,±5%Sizes0075/0100/0201/0402/0603/0805/1206/1210/1218/2010/2512Ro...
2024-12-1219531.06 MB10页229
IC封装资料_电容_0805B472K251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-128441.26 MB20页272
IC封装资料_电容_CL10C471JC8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12777316.26 KB3页216
IC封装资料_电感_SWPA252010S1R0NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1217681.32 MB22页40
IC封装资料_电容_C823D562J60Q350.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-124532.9 MB5页267
IC封装资料_电源管理芯片_LTC4266IUHF_PBF.pdf
LTC426614266fgFormoreinformationwww.linear.com/LTC4266nHighPowerPSESwitches/RoutersnHighPowerPSEMidspansApplicAtionsFeAturesDescri...
2024-12-121691488.33 KB32页291
IC封装资料_连接器_1806261.pdf
https://www.phoenixcontact.com/us/produkte/180626110.10.2012Page1/6Basestrip-GMSTB2,5/6-GF-7,62-1806261Pleasebeinformedthatthedata...
2024-12-121145186.24 KB6页173
IC封装资料_连接器_1806258.pdf
https://www.phoenixcontact.com/us/products/180625810/27/2014Page1/7Basestrip-GMSTB2,5/5-GF-7,62-1806258Pleasebeinformedthatthedata...
2024-12-121849283.65 KB7页44
IC封装资料_电源管理芯片_LTC4263CDE-1_TRPBF.pdf
LTC4263-1142631faTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONHighPowerSinglePSEControllerwithInternalSwitchTheLTC®4263-1isah...
2024-12-12246371.4 KB20页298
IC封装资料_电阻_RC0603JR-0710KL.pdf
DATASHEETGENERALPURPOSECHIPRESISTORSRC_Lseries±0.1%,±0.5%,±1%,±5%Sizes0075/0100/0201/0402/0603/0805/1206/1210/1218/2010/2512Ro...
2024-12-129091.06 MB10页3

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