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IC资料

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IC封装资料_电容_GRM155R61A225ME95D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12987920.26 KB29页107
IC封装资料_电容_CL10C471KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121730316.52 KB3页98
IC封装资料_电容_CL10A476MR8NZNE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12861259.58 KB3页23
IC封装资料_电容_CL10C471JE8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12443316.34 KB3页269
IC封装资料_电容_C823D822J60Q350.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-129742.9 MB5页286
IC封装资料_电容_0805B472K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-123661.26 MB20页110
IC封装资料_连接器_1806287.pdf
https://www.phoenixcontact.com/us/produkte/180628719.10.2012Page1/6Basestrip-GMSTB2,5/8-GF-7,62-1806287Pleasebeinformedthatthedata...
2024-12-12568186.6 KB6页140
IC封装资料_电感_SWPA252010S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1216231.32 MB22页208
IC封装资料_连接器_1806274.pdf
https://www.phoenixcontact.com/us/products/180627410/27/2014Page1/5Basestrip-GMSTB2,5/7-GF-7,62-1806274Pleasebeinformedthatthedata...
2024-12-12306171.43 KB5页21
IC封装资料_电阻_RN14W1KFTBA1.pdf
21ReferenceStandardsIEC60115-1JISC5201-1RNseriesPRECISIONMETALFILMRESISTORSELECTRICALANDMECHANICALPERFORMANCEENVIRONMENTALCHARACTE...
2024-12-121502497.45 KB2页283
IC封装资料_电感_SWPA252010S1R5NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129141.32 MB22页131
IC封装资料_电阻_RLP25FEER003.pdf
HighPowerCurrentSensingResistorsRLPSeries(Halogen-Free)AEC-Q200-VerDqualifiedDocumentNoTRLP-250S008FIssueddate2016/10/11page1/6TA-...
2024-12-12115530.31 KB6页84
IC封装资料_电源管理芯片_LTC4267CGN_TRPBF.pdf
LTC426714267fcPoweroverEthernetIEEE802.3afPDInterfacewithIntegratedSwitchingRegulatorTheLTC®4267combinesanIEEE802.3afcompliantPow...
2024-12-1211892.08 MB32页7
IC封装资料_电容_GRM1555C1H151JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12934920.26 KB29页111
IC封装资料_电容_CL10C510JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12976259.57 KB3页172
IC封装资料_电容_GRM155R61A274KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1255920.26 KB29页278
IC封装资料_电容_CL10C500JC81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121238259.57 KB3页59
IC封装资料_连接器_1806300.pdf
https://www.phoenixcontact.com/us/products/180630010/27/2014Page1/5Basestrip-GMSTB2,5/10-GF-7,62-1806300Pleasebeinformedthatthedat...
2024-12-12341171.71 KB5页113
IC封装资料_电容_CL10B101KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12306259.58 KB3页158
IC封装资料_连接器_1806290.pdf
https://www.phoenixcontact.com/us/products/180629010/27/2014Page1/5Basestrip-GMSTB2,5/9-GF-7,62-1806290Pleasebeinformedthatthedata...
2024-12-121183169.28 KB5页83

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