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IC资料

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IC封装资料_电容_CL10F105ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121664259.58 KB3页299
IC封装资料_电容_CL10F104ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12563259.58 KB3页298
IC封装资料_电容_C3216X5R1C476MTJ00N.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-129551.61 MB56页170
IC封装资料_接口及驱动芯片_ISO3082DWR.pdf
12345678910111213141516RREDGND1ncVcc2BAncGND2DEDW�PACKAGEVcc1GND1GND2GND2GND1function�diagramDRBA1312DE6534REGALVANICISOLATIONIS...
2024-12-122781.04 MB20页114
IC封装资料_电容_GRM1555C1H471FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12626920.26 KB29页99
IC封装资料_电容_CL10F105ZO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F105ZO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-124161.42 MB36页224
IC封装资料_电源管理芯片_LTC4415EDHC_TRPBF.pdf
LTC441514415faTypicalapplicaTionFeaTuresDescripTionDual4AIdealDiodeswithAdjustableCurrentLimitTheLTC®4415containstwomonolithicPow...
2024-12-12315435.08 KB20页252
IC封装资料_电容_C3216X5R1E476MTJ00E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-123531.61 MB56页293
IC封装资料_电源管理芯片_LTC4414EMS8_PBF.pdf
1LTC44144414fc,LT,LTCandLTMareregisteredtrademarksofLinearTechnologyCorporation.PowerPathandThinSOTaretrademarksofLinearTechnology...
2024-12-1290245.13 KB12页74
IC封装资料_电容_GRM155R61E104KA87D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12639920.26 KB29页35
IC封装资料_连接器_1827910.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12140636.13 MB445页11
IC封装资料_电容_CL10B103KB8NFNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-123587.55 MB84页254
IC封装资料_电感_WPN4020H1R5MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121911624.92 KB9页280
IC封装资料_电源管理芯片_LTC4415EMSE_TRPBF.pdf
LTC441514415faTypicalapplicaTionFeaTuresDescripTionDual4AIdealDiodeswithAdjustableCurrentLimitTheLTC®4415containstwomonolithicPow...
2024-12-121590435.08 KB20页298
IC封装资料_电容_CL10B103KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12815259.58 KB3页185
IC封装资料_电容_0805B822K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-128891.26 MB20页248
IC封装资料_电容_0805B821K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210301.05 MB27页108
IC封装资料_接口及驱动芯片_MAX485ESA.pdf
GeneralDescriptionTheMAX481,MAX483,MAX485,MAX487–MAX491,andMAX1487arelow-powertransceiversforRS-485andRS-422communication.Eachpar...
2024-12-121898462.72 KB17页219
IC封装资料_电容_GRM1555C1H471GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12347920.26 KB29页274
IC封装资料_电感_WPN4020H2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121673624.92 KB9页171

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